DeepMaterial (Shenzhen) Co., Ltd. is an innovative company that manufactures industrial adhesives. In the latest record, the company has introduced new products, Industrial Hot Melt Adhesive Manufacturer, Hot Melt Adhesive Manufacturer, and Electronic Assembly Adhesive, in its vast collection.
The company continues to modify the application of adhesives and resin materials, and the company’s strategic plan will focus on developing EB-curing adhesives and new semiconductor materials. DeepMaterial generates reactive hot melt pressure-sensitive adhesive manufacturers and supplies. The company manufactures the following products:
One-component epoxy underfills adhesives, hot melt adhesives glue, UV curing adhesives, high refractive index optical adhesive, magnet bonding adhesives, best top waterproof structural adhesive glue for plastic to metal and glass, electronic adhesives glue for electric motor and micro motors in home appliance.
Furthermore, as an industrial epoxy adhesive manufacturer, the company does lots of research about underfilling epoxy and nonconductive glue for electronics. They have also studied nonconductive epoxy, adhesives for electronic assembly, underfill adhesive, and high refractive index epoxy. Based on that, they have developed the latest technology in the industrial epoxy adhesive.
In addition, the adhesive manufacturing company has also developed industrial adhesives for chip packaging and testing, circuit board-level adhesives, and electronic products. Based on bonds, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing, chip packaging, and testing.
DeepMaterial facilitates different kinds of products about industrial adhesives for electric, UV curing UV adhesive series. It also generates the reactive type of hot melt adhesive, and pressure-sensitive hot melt adhesive series with epoxy-based chip underfill and COB encapsulation materials series. Their circuit board protection potting and conformal coating adhesive series, epoxy-based conductive silver adhesive series, structural bonding adhesive series, functional protective film series, and semiconductor protective film series are also available.
Their products entail the following features:
To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,
To solve the customers mentioned above in process protection, product high-precision bonding, and electrical performance.
The market adhesive application works for the building materials industry (composite panels). The application of EB curing and irradiation technology in the direction of semiconductor materials will break through Japanese companies’ current technological monopoly of semiconductor protective materials and achieve a technical overtaking curve.
Consequently, DeepMaterial is an industrial hot melt electronic component epoxy adhesive and sealants glue manufacturer. The company is known to produce the best top strongest waterproof structural adhesive glue for plastic to metal and glass, semiconductor adhesives for electronic assembly, chip adhesive for epoxy underfill, and magnet bonding adhesives glue for magnets in electric motors.
About the company – DeepMaterial
Shenzhen DeepMaterial Technologies Co., Ltd specializes in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing.
Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.
For more information, visit https://www.epoxyadhesiveglue.com/.