System in Package Industry (SiP) Global Trends & Technology Development adds a research on “Global Trends in SiP Technology Development” to its vast collection of latest reports under its Technology section. The report covers SIP Technology, Applications, Development, market size and 2016 forecasts.

Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises.

With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology.

This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.

Companies covered under this research are Amkor, AppleASE, ChipPAC, Inotera Memories, JCET, Kansu, Nan Ya PCBSPIL, TAM, TDK, Unimicron and USI.

Browse complete research spread across 18 pages at:

Table of Contents:

1. Global Development of SIP Technology

1.1 High Levels of Integration and Miniaturization Drive SiP Development

1.2 SiP/Module Design Bundles for Diverse Development

1.3 Entry Barriers to SiP Remain High

2. Development of Global SiP Market Applications

2.1 Smartphones as Key Growth Driver for SiP

2.2 Mobile Devices, Wearables, and IoT Continue to Spur Demand for SiP

3. Development of the Global SiP industry

3.1 Packaging and Testing Service Providers Make Aggressive Move Towards SiP

3.2 IC Substrate Makers Also Extend Reach to SiP

3.3 Foundries Aim for Turnkey Services with SiP

4. Conclusion

List of Companies

List of Figures

Figure 1: How SiP Boosts Levels of Integration and Miniaturization

Figure 2: Major SiP Packaging Technologies

Figure 3: Use of SiP Modules in Smartphones

Figure 4: Global SiP Shipment Value and Growth, 2013-2016

Figure 5: Cooperation and Competition Between Foundries and Packaging and Testing Service Providers

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