Sputtering Target for Semiconductor Market:
The sputtering target is a material necessary for the physical vapor deposition (PVD) process step, and is a key material for preparing thin films. The sputtering process uses ions generated by an ion source and is accelerated in a vacuum to form a flow of teller ions. The high-speed particle flow is used to bombard the solid surface, so that the atoms on the solid surface leave the target and deposit on the substrate surface, thereby forming a thin film. The process of forming this film is called sputtering, and the bombarded solid is called the sputtering target. The target is the core material of the sputtering process.
Global Sputtering Target Key Players:
JX Nippon Mining & Metals Corporation: Ti Target(DB)/ Cu & Cu-Al Alloy Target/ Ta Target(DB)
Honeywell: AI/Ti, Cu/Ta, CoWTiW, TiAL
TOSOH SILICA CORPORATION: Cr, Co-Ni-Cr, Co-Nb-Zr, ZAO, ITO, Ni-Cr-Si, Cr-Si, Al, Al-Cu, Al-Si, Al-Si-Cu, C, Ta, TaSi2, Ti, Ti-W, others.
Praxair: AdvanTage™ tantalum targets/ Fine-grain copper (Cu) and copper alloy targets/ Fine-grain aluminum (Al) alloy targets/ Ultrafine-grain aluminum (Al) alloy targets/ Long-life aluminum (Al) targets (RE-Al â PLUS)/ Alumina-Zinc-Oxide (AZO) targets (ZnO:Al203)/ Standard oxide targets/ Nickel platinum (NiPt) targets/ Long-life titanium (Ti) targets (Re-Ti™)/ Tungsten W targets (high-purity, high-density)
Sumitomo Chemical: Aluminum sputtering target
ULVAC CRYOGENICS INC: Sputtering Targets for ITO/ Sputtering Targets for IGZO
Materion (Heraeus): SFGTM Sputtering Targets/ VCTTM Sputtering Targets
Plansee SE: longest sputtering targets
Hitachi Metals: Ta, Ru, Co-Fe-B, WSi, MoSi, TaSi, Ti-W, W TiSi, Ni-Cr, CrSi, Cr-B, Cr-Al
In the field of sputtering targets, American and Japanese companies occupy a major share of the global market. Sputtering targets are a typical high-tech barrier industry. Since the origin of targets is developed abroad, high-end products are monopolized by foreign companies represented by the United States and Japan. Nippon Metals, Honeywell, Tosoh, Praxair, Sumitomo Chemical, etc. occupy the main share of the global target market.
Sputtering Targets Classifications
There are many types of sputtering targets, and there are different types according to different classification standards. Sputtering targets can be classified by shape, chemical composition and application field.
Classification by Shape
Classification by Chemical Composition
Metal targets (pure metal aluminum, titanium, copper, tantalum, etc.), alloy targets
Materials (nickel-chromium alloy, nickel-cobalt alloy, etc.), ceramic compound targets
(Oxides, silicides, carbides, sulfides, etc.)
Classification by Application Field
Semiconductor chip targets, flat display targets, solar cells
Targets, information storage targets, tool improvement targets, electronics
Target, other target
Sputtering Targets Applications
Sputtering target materials have a wide range of application fields. Due to the different application fields, sputtering target materials have different choices and performance requirements for metal materials. Among them, semiconductor chips have the highest technical requirements for target materials, and have extremely high standards for metal purity and internal microstructure.
Field of application
Flat panel displays: Cr, Cr alloys (Cr-Mo and others); Mo, Mo alloys (Mo-W/Mo-Nb and others); Al, Al alloys (Al-Ti and others); Ag alloys; Cu, Cu alloys (Cu-Cr and others)
Hard disks: Cr alloys (Cr-Mo, Cr-Ti, Cr-W and others); Ni alloys (Ni-Al, Ni-P and others); Ru, Ru alloys (Ru-Al and others); Co alloys (Co-Cr-Ta-B and others), Ti alloys, alloys for soft magnetic films (Fe-Co-B, Fe-Ta-C, Co-Nb-Zr and others) Cr
Semiconductors: Ta, Ru, Co-Fe-B, WSi, MoSi, TaSi, Ti-W, W
Other: TiSi, Ni-Cr, CrSi, Cr-B, Cr-Al
Target Preparation Method
According to different production processes, the preparation of sputtering targets can be divided into melt casting and powder metallurgy.
The melting casting method is one of the basic methods for preparing magnetron sputtering targets. Commonly used melting methods include vacuum induction melting, vacuum arc melting and vacuum electron bombardment melting. High-purity metals such as Al, Ti, Ni, Cu, Co, Ta, Ag, Pt, etc. have good plasticity. After further melting and casting directly on the original ingot, thermomechanical treatment techniques such as forging, rolling and heat treatment are carried out Organization control and blank forming.
Compared with the powder metallurgy method, the target product produced by the melt casting method has low impurity content and high density, but there is a certain porosity inside the material, and subsequent thermal processing and heat treatment processes are required to reduce its porosity.
Powder metallurgy is the main preparation method of sputtering target materials at present, which has the advantages of easy to obtain a uniform fine crystal structure, saving raw materials, and high production efficiency. Generally, the melt casting method cannot achieve the preparation of refractory metal sputtering targets. For two or more metals with large differences in melting point and density, it is generally difficult to obtain an alloy target with a uniform composition by using the ordinary melt casting method. For inorganic non-metallic targets and composite targets, the melt casting method is powerless, and the powder metallurgy method is the best way to solve the technical problems of preparing the above targets.
When preparing the target material by powder metallurgy, the key lies in: one is to select high-purity, ultra-fine powder as the raw material; the other is to select the forming and sintering technology that can achieve rapid densification to ensure the low porosity of the target and control the grain size ; The third is to strictly control the introduction of impurity elements in the preparation process.
Since the COVID-19 virus outbreak in December 2019, the disease has spread to almost 100 countries around the globe with the World Health Organization declaring it a public health emergency. The global impacts of the coronavirus disease 2019 (COVID-19) are already starting to be felt and will significantly affect the Sputtering Target market in 2020.
COVID-19 can affect the global economy in three main ways: by directly affecting production and demand, by creating supply chain and market disruption, and by its financial impact on firms and financial markets.
The outbreak of COVID-19 has brought effects on many aspects, like flight cancellations; travel bans and quarantines; restaurants closed; all indoor events restricted; over forty countries state of emergency declared; massive slowing of the supply chain; stock market volatility; falling business confidence, growing panic among the population, and uncertainty about future.
This report also analyses the impact of Coronavirus COVID-19 on the Sputtering Target industry.
Based on our recent survey, we have several different scenarios about the Sputtering Target YoY growth rate for 2020. The probable scenario is expected to grow by a xx% in 2020 and the revenue will be xx in 2020 from US$ xx million in 2019. The market size of Sputtering Target will reach US$ xx in 2026, with a CAGR of xx% from 2020 to 2026.
From the domestic situation, the domestic high-purity sputtering target market size in 2015 was 6011 million US dollars, and will reach xx million US dollars by 2026. In recent years, with the rapid development of the domestic semiconductor industry, China’s fabs have ushered in the peak of investment and construction, and the market size of the semiconductor materials field will grow rapidly
Under the influence of the new coronavirus (COVID-19), some factories in Japan are temporarily closed. China is currently in the late stage of the epidemic, and large-scale resumption of production can be achieved. In Europe, America, and Japan, the situation is serious, China can be the largest substitute The factory carries out production, and, during this period, the prospects of China’s semiconductor materials industry have reached a climax.
Due to the irregular role of sputtering ions, the sputtering target is prone to uneven erosion during the sputtering process, resulting in a generally low utilization rate of sputtering targets. In recent years, by improving the sputtering machine and strengthening product development, the utilization rate of sputtering targets has increased, but there is still much room for improvement. How to use the sputtering target is an important direction for future target research.
Sputtering target development towards large size and high purity
The technological development trend of sputtering targets is closely related to the technological innovation in the downstream application field. With the technological progress of the application market in thin film products or components, the sputtering targets need to change accordingly. In the downstream application fields, the semiconductor industry has the highest quality requirements for sputtering targets and sputtering films. As larger-sized silicon wafers are manufactured, the sputtering targets are also required to move toward larger sizes. At the same time, it also puts forward higher requirements for the crystal orientation control of the sputtering target. The purity of the sputtered film is closely related to the purity of the sputtering target. In order to meet the needs of semiconductors with higher precision and finer micron technology, the purity of the sputtering target required continues to rise, even reaching 99.9999% (6N) purity.
QY Research has recently curated a research report titled, Global Sputtering Target for Semiconductor Market Research Report 2020. The report is structured on primary and secondary research methodologies that derive historic and forecast data. The global Sputtering Target for Semiconductor market is growing remarkably fast and is likely to thrive in terms of volume and revenue during the forecast period. Readers can gain insight into the various opportunities and restraints shaping the market. The report demonstrates the progress and bends that will occur during the forecast period.
Global Sputtering Target for Semiconductor Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of sales about the global market and also about each type from 2015 to 2026. This section mentions the volume of sales by region from 2015 to 2026. Pricing analysis is included in the report according to each type from the year 2015 to 2026, manufacturer from 2015 to 2020, region from 2015 to 2020, and global price from 2015 to 2026.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Sputtering Target for Semiconductor Market: Segment Analysis
The research report includes specific segments such as application and product type. Each type provides information about the sales during the forecast period of 2015 to 2026. The application segment also provides revenue by volume and sales during the forecast period of 2015 to 2026. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Global Sputtering Target for Semiconductor Market: Regional Analysis
The research report includes a detailed study of regions of North America, Europe, Asia Pacific, Latin America, and Middle East and Africa. The report has been curated after observing and studying various factors that determine regional growth such as economic, environmental, social, technological, and political status of the particular region. Analysts have studied the data of revenue, sales, and manufacturers of each region. This section analyses region-wise revenue and volume for the forecast period of 2015 to 2026. These analyses will help the reader to understand the potential worth of investment in a particular region.
Global Sputtering Target for Semiconductor Market: Competitive Landscape
This section of the report identifies various key manufacturers of the market. It helps the reader understand the strategies and collaborations that players are focusing on combat competition in the market. The comprehensive report provides a significant microscopic look at the market. The reader can identify the footprints of the manufacturers by knowing about the global revenue of manufacturers, the global price of manufacturers, and sales by manufacturers during the forecast period of 2015 to 2019.
Following are the segments covered by the report are:
Metal Sputtering Target Material
Alloy Sputtering Target Material
The Key manufacturers that are operating in the global Sputtering Target for Semiconductor market are:
JX Nippon Mining & Metals Corporation
Mitsui Mining & Smelting
GRIKIN Advanced Material Co., Ltd.
The analysts have provided a comprehensive analysis of the competitive landscape of the global Sputtering Target for Semiconductor market with the company market structure and market share analysis of the top players. The innovative trends and developments, mergers and acquisitions, product portfolio, and new product innovation to provide a dashboard view of the market, ultimately providing the readers accurate measure of the current market developments, business strategies, and key financials.
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