New Challenge of Heat Dissipation for Electronic Equipment:Thermal Conductive Adhesive as a Breakthrough Point

With the rapid advancement of 5G communications, artificial intelligence, new energy vehicles, and high-end computing devices, the power density of electronic components continues to rise, making thermal management a critical bottleneck for device performance and reliability. In this context, thermal interface materials (TIMs)—particularly high-performance Thermal Adhesives—are transitioning from the background to the forefront, emerging as the preferred solution for thermal management in electronic design.

With years of expertise in electronic chemicals, Chengdu Santam Technology Co., Ltd. has developed a comprehensive range of thermal conductive adhesive solutions for diverse applications, providing end-to-end thermal management support for global clients from chip-level to system-level.

Market Hotspot: How Thermal Adhesive Reshapes Three Key Fields1. New Energy Vehicles: The “Heat Guardian” of Electrification

The three-electric system (battery, motor, and electronic control) in electric vehicles imposes extremely high demands on heat dissipation:

• Thermal Management for Power Batteries:Santam Technology’s ultra-high thermal conductivity structural adhesive (≥0 W/m·K) provides stable heat conduction pathways for battery modules, ensuring uniform temperature distribution and enhancing both safety and cycle life.

• Power module thermal management: Engineered for IGBT and SiC modules, this low-thermal-resistance insulating thermal adhesive delivers exceptional electrical insulation (breakdown voltage>10 kV/mm), meeting automotive-grade AEC-Q200 reliability standards to enable higher power density.

• Intelligent cockpit and autonomous driving: Provides high thermal conductivity and flexible joint filling materials for high-performance domain controllers, ensuring long-term stable operation of components with varying expansion coefficients.

2. 5G Communication and Data Center: The “Calm Cornerstone” in the Era of High Computing Power

The thermal flux density of 5G base station AAUs and server chips has seen a sharp increase.

• 5G Massive MIMO Antenna: Engineered for extreme outdoor conditions, this product features weather-resistant thermal conductive structural adhesive that delivers both high-strength bonding and efficient heat dissipation (thermal conductivity adjustable between 2.5-5.0 W/mK), ensuring reliable signal transmission.

• Data centers and AI servers: These applications utilize ultra-low thermal resistance thermal conductive gels or phase-change materials for high-power chips like GPUs and CPUs, designed for micro-gap filling. The thermal resistance can be as low as <0.1℃·cm²/W, significantly reducing junction temperature.

• Heat dissipation of optical module: Develop a high transparency and low stress thermal conductive adhesive specifically for high-speed optical devices, without affecting optical path transmission.

3. Consumer Electronics and Wearable Devices: The “Invisible Thermal Barrier” of Slim Designs

As devices grow increasingly slim and compact, the space for heat dissipation is being squeezed to the limit.

Smartphones/Tablets: Provides ultra-thin coated thermal conductive adhesive films for SoC chips and memory, with thickness controllable between 25-100μm, enabling efficient heat dissipation without increasing device thickness.

AR/VR devices: Develop flexible, high-thermal-conductivity silicone materials to meet the dual requirements of comfort and heat dissipation in wearable devices.

Flexible displays and foldable devices: We provide heat-resistant adhesive solutions with anti-bending fatigue properties for flexible circuits and hinge areas, ensuring thermal performance remains stable after repeated bending cycles.

Thermal Adhesive Technology Matrix ofSantam Technology: Precise Matching of Different Heat Dissipation Requirements

product line	thermal conductivity (W/m·K)	key property	Typical application scenarios
thermal conductive gel	1.5 – 5.0	Ultra-low thermal resistance, automatic gap-filling, and convenient installation	Irregular gap filling between the chip and the heat sink
thermal conductive structural adhesive	1.0 – 3.0	High bonding strength, structural support, and aging resistance	Heat dissipation module fixation and bonding of automotive components
thermal conductive phase change material	2.0 – 8.0	Ultra-low interfacial thermal resistance after phase transition, no vertical flow	High-power CPU/GPU, power semiconductors
thermal filler	1.0 – 4.0	High compression recovery elasticity and excellent long-term stability	Pack battery gap, chassis gap filling
thermal conductive tape/film	0.8 – 2.5	Insulation, ultra-thin, excellent die-cutting processability	Heat dissipation for mobile/tablet chips and LED backlight modules

Core Competence of Santam Technology: More than Materials, Providing Systematic Thermal Management Solutions

1. Customized material R&D capabilities

• Innovative basic resin systems: Independently synthesized various resins including silicone, epoxy, and polyurethane to meet diverse curing and temperature resistance requirements.

• Breakthrough in filler technology: Mastering surface treatment and compounding techniques for various fillers including alumina, boron nitride, aluminum nitride, and graphene, while enhancing thermal conductivity while controlling viscosity and cost.

• Formula database support: With over 500 ready-to-use formulas, it enables quick matching or customized development for customer scenarios.

2. Full-Spectrum Technical Support from Simulation to Mass Production

• Thermal simulation-assisted design: Provides material thermal parameters to assist customers in preliminary heat dissipation simulation.

• Process adaptation guidance: Provides optimization recommendations and parameter settings for various construction processes including dispensing, screen printing, molding, and coating.

• Reliability validation system: Provides comprehensive aging and failure analysis data, including high-temperature/high-humidity conditions, thermal shock, and vibration testing.

3. Quality Assurance and Global Service Network

• A high-standard production system featuring Class 10,000 cleanrooms and dual certifications under ISO 9001 and IATF 16949 quality management systems.

• Stable supply chain: Multiple sources of key raw materials ensure consistent production capacity and delivery.

• Global Rapid Response: Technical support centers are established in East China, South China, and Europe (Germany) to provide localized services.

Successful Case Studies Case 1: Thermal Management of Battery Pack in New Energy Vehicle Manufacturers

• Challenge: Uneven voids within the battery module and poor contact of traditional gaskets result in localized hot spots.

• Solution: UseSantam Technology’s two-component flowable Thermal Conductive Sealant (thermal conductivity: 3.5 W/mK).

• Achievement: Achieved full gap coverage with no blind spots, reducing overall temperature difference by 40%. Passed rigorous vibration and thermal shock tests, with stable supply for over two years.

Case 2: GPU Cooling Modules from the Top 5 Global Server Vendors

• Challenge: The next-generation AI server GPU consumes over 500W of power, while traditional thermal pads exhibit excessive thermal resistance.

• Solution: Custom-developed high-thermal-conductivity phase-change material sheets (thermal conductivity: 5.0 W/mK).

• Achievement: Reduced interface thermal resistance by 60% and decreased GPU junction temperature by 15°C, enabling customers to successfully launch their products.

Four Values of Choosing Santam Technology

• Outstanding performance: The product matches top-tier international brands, with some metrics even surpassing them.

• Customization: Our robust R&D capabilities enable swift responses to clients’ unique requirements.

• Reliable supply: Localized production ensures supply chain security and stable delivery schedules.

• Cost optimization: Deliver cost-effective solutions to help customers reduce overall expenses.

Take action now to inject cool power into your product

To address the more severe thermal management challenges of next-generation electronic devices, a reliable material partner is essential. Chengdu Santam Technology looks forward to collaborating with you to explore the boundless possibilities of thermal management.

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Company Name: Chengdu Santam Technology Co., Ltd.
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Country: China
Website: https://www.santams.com/