Global Semiconductor Wafer Cleaning Equipment Market is estimated to be USD 15.3 billion by 2027 (forecast year) from USD 7.5 billion in 2020 (estimated year), at a CAGR of 9.5% between 2020 to 2027.
Semiconductor wafer cleaning is the removal of particles/impurities from the semiconductor surface without altering the quality of the surface. The performance of the device & its reliability is affected considerably due to the presence of contaminants & particulate impurities on the wafers of device’s surface.
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Key Insights & Findings:
Emerging new technologies & increased consumer demand for more advanced smartphones as well as tablets have boosted the growth pace of the industry to a great extent.
The tremendous growth in the tablets & smartphones market has accelerated the demand for the semiconductor wafers, thus raising the need for wafer cleaning.
APAC region currently occupies a significant share in the market due to the fact that this region is home to most of the major semiconductor manufacturers.
Also, it is the fastest growing region in the industry due to the rise in the adoption of consumer electric devices.
List of the key players of Global Semiconductor Wafer Cleaning Market
- Tokyo Electron Limited
- Kla Tencor Corp.
- SCREEN Holdings Co. Ltd.
- FSI International
- Cleaning Technologies Group
- Solid State Equipment
- Semsysco GmbH
- Modutek Corporation
- Falcon Process Systems, Inc
- MEI Wet Processing Systems and Services LLC.
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Key Development Global Semiconductor Wafer Cleaning Market
In March 2019 – Tokyo Electron had announced the upcoming launch of its Cellesta Pro SPM single wafer cleaning system.in Cellesta Pro SPM is a unique wafer SPM processing system for wet metal etching with controlled selectivity for TiN & W films, as well as post-CMP & post-ash clean processes.
Qualiket Research has segmented the global Semiconductor Wafer Cleaning Equipment Market based on technology, end-equipment type, application and region:
- Wet Chemistry-Based Cleaning Technology
- Etch Cleaning Technology
- Front Side Up Cleaning Technology
By Equipment Type
- Rotary Wafer Etching System
- Semi-Automated Wet Batch System
- Manual Wet Batch System
- Metallic Contamination
- Chemical Contamination
- Particle Contamination
- North America
- Asia Pacific
- Latin America
- Middle East & Africa
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