Semiconductor Packaging Industry Synopsis
Market Research Future (MRFR) has revealed in its findings that the global Semiconductor Packaging Industry is projected to mark 5% CAGR across the evaluation period 2017 to 2023. Packaging materials are used in the final stage of semiconductor fabrication to protect the product from damage and external influence. The thriving business of semiconductors is anticipated to accelerate revenue growth in the market over the next couple of years.
The ongoing trend of miniaturization in the consumer electronics industry is likely to have a favorable impact on the expansion of the Semiconductor Packaging Industry. Also, the rising embedment of integrated circuits in electronics is a primary driver of the Semiconductor Packaging Industry. The rising demand for consumer electronics is expected to influence the market growth greatly in the upcoming years.
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The increase in the income levels of the population is likely to support the expansion of the consumer base of the semiconductor industry. It is, in turn, prognosticated to drive the expansion of the Semiconductor Packaging Industry in the years to come.
Competitive Dashboard
- Hitachi Chemical Company, Ltd. (Japan)
- Henkel AG & Company, KGaA (Germany)
- Sumitomo Chemical Co., Ltd. (Japan)
- Mitsui High-tec, Inc. (Japan)
- Kyocera Chemical Corporation (Japan)
- Toray Industries, Inc. (Japan)
- LG Chem (South Korea)
- Alent plc (U.K.)
- BASF SE (Germany)
- E. I. du Pont de Nemours and Company (U.S.)
- Tanaka Kikinzoku Group (Japan)
- Honeywell International Inc. (U.S.)
- Nippon Micrometal Corporation (Japan)
- Toppan Printing Co., Ltd. (Japan)
- Alpha Advanced Materials (U.S.)
are few of the prominent participants of the Semiconductor Packaging Materials Market analyzed in this MRFR report.
Market Segmentation
The type-wise segmentation of the Semiconductor Packaging Industry covers organic substrates, encapsulation resins, bonding wires, ceramic packages, wafer level packaging dielectrics, solder balls, and others. Among these, the organic substrates segment has been projected to lead the growth of the market over the next couple of years.
The technology-based segments of the Semiconductor Packaging Industry are – dual in-line package, grid array, dual flat no-leads, small outline package, quad flat package, and others. Among these, the grid array segment held the maximum share of the market in 2016 and is assessed to expand at a comparatively higher CAGR across the forecast period.
Industry News
In October 2019, Verizon Wireless, an American telecommunications company, has certified the latest wireless IoT chipset and module by Nordic Semiconductor, a fabless semiconductor company.
In October 2019, China has released funding of USD 28.9 Bn for fighting the dominance of the U.S. semiconductor industry.
In October 2019, ASE Group (ASE), based out of Taiwan, has invested in the advancements of the integrated circuit (IC) semiconductor packaging and development be leveraging ANSYS Customization Toolkit Solution.
In October 2019, IBM Japan, Ltd. has collaborated with Panasonic Smart Factory Solutions Co., Ltd for the improvement of the semiconductor manufacturing processes.
Regional Analysis
The geographical study of the global Semiconductor Packaging Industry spans across four regions, which are – North America, Asia Pacific (APAC), and the Middle East & Africa (MEA). These regional segments assessed in this analysis are then narrowed down on the basis of key country-level markets. Asia Pacific holds the pole position in the market and is supposed to maintain it in the years to come. Increasing investments in the electrical & electronics industry in the region is likely to guide the future trajectory of the semiconductor packaging materials market in the foreseeable future. In addition, the presence of an established semiconductor industry in countries such as Taiwan, China, and Japan is further analyzed to catalyze market growth over the forecast period.
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