Semiconductor Manufacturing Equipment Market to Grow at 5.2% CAGR and Reach $101.58 Billion by 2027 Led by Lam Research, Rudolph, Screen Holdings, Teradyne, Tokyo Electron, Advantest, ASML Holding

“Semiconductor Manufacturing Equipment Industry”
The content of the Semiconductor Manufacturing Equipment Market report showcase authentic section of each market segments like type, application, end user in an insightful arrangement. It Includes conclusive market numbers in for of relevant charts and tables to empower market players understand market scenario and viewpoints of different experts and industry leaders from the said market.

This report focuses on the Semiconductor Manufacturing Equipment Market Size, Revenue, Share, status, future forecast, growth opportunity, key market dynamics and key players. The study objectives are to present the Semiconductor Manufacturing Equipment development in North Americas, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America (SA).

The global semiconductor manufacturing equipment market accounted to US$ 62.10 Bn in 2018 and is expected to grow at a CAGR of 5.2% during the forecast period 2019 – 2027, to account to US$ 101.58 Bn by 2027.

The major players operating in the market for semiconductor manufacturing equipment market include Advantest Corporation, Applied Materials, Inc., ASML Holding N.V., Hitachi High-Technologies Corporation, KLA Corporation, Lam Research Corporation, Rudolph Technologies, Inc., Screen Holdings Co., Ltd., Teradyne Inc., and Tokyo Electron Ltd. among others.

The semiconductor manufacturing equipment market is experiencing high growth in the forecast period. Increasing computing powers, longer battery life, demands for higher memory storages, and higher processing capabilities in a plethora of day-to-day applications are satiated using the semiconductor material based devices.

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Smartphones lead the incorporations of semiconductor equipment into the devices. As per the Ericsson’s latest mobility report, the number of mobile subscriptions grew at $ percent year-on-year basis and has reached 7.9 billion in the first quarter of 2018. The number of mobile broadband subscriptions are growing at 20 percent year-on-year reaching a total of 5.5 billion in the first quarter of 2018. The number of mobile subscriptions exceeds the population in many countries, which is largely due to inactive subscriptions, multiple device ownership or optimization of subscriptions for different types of calls. As a result, the number of subscribers is lower than the number of subscriptions. Today, there are around 5.3 billion subscribers globally compared to 7.9 billion subscriptions. Also, 98 million new mobile subscriptions was observed globally in first quarter of 2018.



The emerging packaging techniques being employed in the semiconductor manufacturing process today include 2.5D & 3D packaging through the technology Through Silicon Vias (TSV), Wafer Level packaging Technologies, and Fan-in as well as Fan-out technologies at the panel level. Furthermore, redistribution layer material (RDL) is used in these advanced semiconductor packaging technologies to maintain proper conductivity in the circuit and enhance the functioning between the I/O pads and IC. These advanced packaging technologies are anticipated to have a significant impact in the manufacturing process for semiconductors and therefore directly impact the semiconductor manufacturing equipment market.

Huge populations of India and China are further proliferating the growing penetration of smart phones and other consumer electronic devices. The rising needs for semiconductor ICs in the consumer electronics coupled with breath-taking pace discovery for applications in this industry are anticipated to drive the market for semiconductor manufacturing equipment in the coming years. Security is another major cause of concern facing in the semiconductor industry especially in the medical and industrial automation applications. Manufacturing of secured chips for these applications further adds to the costs. Hence, the added demands for integration of security based features in the ICs pose another set of challenges to the semiconductor manufacturing equipment market. Semiconductor packaging forms an integral and important part of the semiconductor manufacturing process. IC packaging is important as the semiconductor industry faces constant trade-offs between the performance of the devices and reducing the IC footprints. Advanced packaging techniques ensure longer battery life, higher performance, and integration of multi-functionalities while reducing the IC footprint integrated into any electronics device.

The semiconductor manufacturing equipment market has been derived from market trends and revenue generation factors from five different regions across the globe namely; North America, Europe, Asia Pacific, Middle East, and Africa, and South America. APAC is expected to be the fastest growing region in global semiconductor manufacturing equipment market followed by North America and Europe in the semiconductor manufacturing equipment market. Major of the economies of Asia Pacific are aggressively pursuing for advanced technologies to optimize productivity with higher efficiency. The region has become a global manufacturing hub with presence of diverse manufacturing industries. Among China’s evolution into a high-skilled manufacturing hub, other developing countries such as India, South Korea, Taiwan and Vietnam among others are attracting several businesses that are in quest to relocate their low to medium skilled manufacturing facilities to neighboring countries, offering lower labor cost. Further, the governments of these countries are making developments to improve investment ideas.

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The governments are offering tax-rebates, funds, subsidies and other such support to attract the manufacturing companies to set-up plants in their respective countries. Further, several governments have taken initiatives such as Made in China 2025, and Make in India, among others to propel the growth of manufacturing and other high-tech industries. Also, Taiwan has an advantage of holding vital source of technology which supports for the development of semiconductor industry. In addition to this, different initiatives such as investment funding are undertaken by the players to promote entire semiconductor industrial growth. For instance, Tsinghua Unigroup plans to expand memory chip products by making an investment of $100 billion with a motive to nurture and drive the semiconductor industry. The high growth in semiconductor manufacturing equipment is driven by high demand for more semiconductor applications in automotive, industrial, consumer goods, and other electronic products including wireless, storage products. Major portion of revenue contribution in the fabrication of semiconductor products is played by memory chips and sensors used in several application for different purposes. Similarly, with growing demand if semiconductors including front-end fab capacity, China is to observe a high growth for better semiconductor manufacturing equipment by 2020.




The report segments the global semiconductor manufacturing equipment market as follows:

1.1.1 Global Semiconductor Manufacturing Equipment Market – By Equipment Type

  • Wafer Manufacturing Equipment
  • Assembly & Packaging Equipment
  • Test Equipment
  • Others


1.1.2 Global Semiconductor Manufacturing Equipment Market – By Dimension

  • 2D
  • 2.5D
  • 3D


1.1.3 Global Semiconductor Manufacturing Equipment Market – By End User

  • Semiconductor Fabrication Plant/Foundry
  • Semiconductor Electronics Manufacturing
  • Test Home


1.1.4 Global Semiconductor Manufacturing Equipment Market – By Geography

  • North America
    • U.S.
    • Canada
    • Mexico


  • Europe
    • France
    • Germany
    • Italy
    • Russia
    • UK
    • Rest of Europe


  • Asia Pacific (APAC)
    • Singapore
    • China
    • Taiwan
    • Japan
    • South Korea
    • Rest of Asia-Pacific


  • Rest of World (RoW)
    • Middle East and Africa (MEA)
    • South America (SAM)


Key Benefits of Buying this Research Study:

  1. Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the global Semiconductor Manufacturing Equipment market
  2. Highlights key business priorities in order to assist companies to realign their business strategies
  3. The key findings and recommendations highlight crucial progressive industry trends in the Semiconductor Manufacturing Equipment market, thereby allowing players across the value chain to develop effective long term strategies
  4. Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
  5. Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it
  6. Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution
  7. Examine the political, economic, social and technology impact of the five regions namely: North America, Europe, Asia Pacific, Middle East & Africa and South America.


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