Plating for Microelectronics Market to 2023 –Global Market Size, Development Status, Top Manufacturers, and Forecasts

“Plating for Microelectronics Market to 2023”
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Description:                                                                                                 

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

 

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Scope of the Report: 
This report focuses on the Plating for Microelectronics in global market, especially in North America, Europe, Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, types and applications. 
Market Segment by Manufacturers, this report covers 
DOW 
Mitsubishi Materials Corporation 
Heraeus 
XiLong Scientific 
Atotech 
Yamato Denki 
Meltex 
Ishihara Chemical 
Raschig GmbH 
Japan Pure Chemical 
Coatech 
MAGNETO special anodes 
Vopelius Chemie AG 
Moses Lake Industries 
JCU International

Market Segment by Regions, regional analysis covers 
North America (United States, Canada and Mexico) 
Europe (Germany, France, UK, Russia and Italy) 
Asia-Pacific (China, Japan, Korea, India and Southeast Asia) 
South America (Brazil, Argentina, Colombia) 
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers 
Electroplating 
Electroless 
Immersion

Market Segment by Applications, can be divided into 
Gold 
Zinc 
Nickel 
Bronze 
Tin 
Copper 
Others

 

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Table Of Contents – Major Key Points

1 Market Overview 
1.1 Plating for Microelectronics Introduction 
1.2 Market Analysis by Type 
1.2.1 Electroplating 
1.2.2 Electroless 
1.2.3 Immersion 
1.3 Market Analysis by Applications 
1.3.1 Gold 
1.3.2 Zinc 
1.3.3 Nickel 
1.3.4 Bronze 
1.3.5 Tin 
1.3.6 Copper 
1.3.1 Others 
1.4 Market Analysis by Regions 
1.4.1 North America (United States, Canada and Mexico) 
1.4.1.1 United States Market Status and Outlook (2013-2023) 
1.4.1.2 Canada Market Status and Outlook (2013-2023) 
1.4.1.3 Mexico Market Status and Outlook (2013-2023) 
1.4.2 Europe (Germany, France, UK, Russia and Italy) 
1.4.2.1 Germany Market Status and Outlook (2013-2023) 
1.4.2.2 France Market Status and Outlook (2013-2023) 
1.4.2.3 UK Market Status and Outlook (2013-2023) 
1.4.2.4 Russia Market Status and Outlook (2013-2023) 
1.4.2.5 Italy Market Status and Outlook (2013-2023) 
1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia) 
1.4.3.1 China Market Status and Outlook (2013-2023) 
1.4.3.2 Japan Market Status and Outlook (2013-2023) 
1.4.3.3 Korea Market Status and Outlook (2013-2023) 
1.4.3.4 India Market Status and Outlook (2013-2023) 
1.4.3.5 Southeast Asia Market Status and Outlook (2013-2023) 
1.4.4 South America, Middle East and Africa 
1.4.4.1 Brazil Market Status and Outlook (2013-2023) 
1.4.4.2 Egypt Market Status and Outlook (2013-2023) 
1.4.4.3 Saudi Arabia Market Status and Outlook (2013-2023) 
1.4.4.4 South Africa Market Status and Outlook (2013-2023) 
1.4.4.5 Nigeria Market Status and Outlook (2013-2023) 
1.5 Market Dynamics 
1.5.1 Market Opportunities 
1.5.2 Market Risk 
1.5.3 Market Driving Force 

2 Manufacturers Profiles 
2.1 DOW 
2.1.1 Business Overview 
2.1.2 Plating for Microelectronics Type and Applications 
2.1.2.1 Type 1 
2.1.2.2 Type 2 
2.1.3 DOW Plating for Microelectronics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.2 Mitsubishi Materials Corporation 
2.2.1 Business Overview 
2.2.2 Plating for Microelectronics Type and Applications 
2.2.2.1 Type 1 
2.2.2.2 Type 2 
2.2.3 Mitsubishi Materials Corporation Plating for Microelectronics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.3 Heraeus 
2.3.1 Business Overview 
2.3.2 Plating for Microelectronics Type and Applications 
2.3.2.1 Type 1 
2.3.2.2 Type 2 
2.3.3 Heraeus Plating for Microelectronics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.4 XiLong Scientific 
2.4.1 Business Overview 
2.4.2 Plating for Microelectronics Type and Applications 
2.4.2.1 Type 1 
2.4.2.2 Type 2 
2.4.3 XiLong Scientific Plating for Microelectronics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.5 Atotech 
2.5.1 Business Overview 
2.5.2 Plating for Microelectronics Type and Applications 
2.5.2.1 Type 1 
2.5.2.2 Type 2 
2.5.3 Atotech Plating for Microelectronics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.6 Yamato Denki 
2.6.1 Business Overview 
2.6.2 Plating for Microelectronics Type and Applications 
2.6.2.1 Type 1 
2.6.2.2 Type 2 
2.6.3 Yamato Denki Plating for Microelectronics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.7 Meltex 
2.7.1 Business Overview 
2.7.2 Plating for Microelectronics Type and Applications 
2.7.2.1 Type 1 
2.7.2.2 Type 2 
2.7.3 Meltex Plating for Microelectronics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 
2.8 Ishihara Chemical 
2.8.1 Business Overview 
2.8.2 Plating for Microelectronics Type and Applications 
2.8.2.1 Type 1 
2.8.2.2 Type 2 
2.8.3 Ishihara Chemical Plating for Microelectronics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017) 

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