Package Substrates Market 2020 Global Analysis, Opportunities and Forecast to 2026

Package Substrates Market 2020 Global Analysis, Opportunities and Forecast to 2026

Global Package Substrates Market 2020
Wiseguyreports.Com Publish New Market Research Report On-“Package Substrates Market 2020 Global Analysis, Size, Share, Trends, Opportunities and Growth, Forecast 2026”

Global Package Substrates Market Insights, Forecast to 2026

Since the COVID-19 virus outbreak in December 2019, the disease has spread to almost 100 countries around the globe with the World Health Organization declaring it a public health emergency. The global impacts of the coronavirus disease 2019 (COVID-19) are already starting to be felt and will significantly affect the Package Substrate market in 2020.

COVID-19 can affect the global economy in three main ways: by directly affecting production and demand, by creating supply chain and market disruption, and by its financial impact on firms and financial markets.

The outbreak of COVID-19 has brought effects on many aspects, like flight cancellations; travel bans and quarantines; restaurants closed; all indoor events restricted; over forty countries state of emergency declared; massive slowing of the supply chain; stock market volatility; falling business confidence, growing panic among the population, and uncertainty about future.

This report also analyses the impact of Coronavirus COVID-19 on the Package Substrate industry.

The package substrate is directly used to carry the chip, which not only provides support, protection and heat dissipation for the chip, but also provides electronic connection between the chip and the PCB motherboard.

Based on our recent survey, we have several different scenarios about the Package Substrate YoY growth rate for 2020. The probable scenario is expected to grow by a -6.9% in 2020 and the revenue will be US$7.4 billion in 2020 from US$ 7.96 billion in 2019. The market size of Package Substrate will reach US$ xx in 2026, with a CAGR of xx% from 2020 to 2026.


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According to Prismark data, the global packaging substrate market bottomed out in 2017, and it is expected that by 2022, it will reach a compound growth rate of 2.9% to reach US $ 7.74 billion. Different from the low growth rate of the global market, the output value of mainland China’s packaging substrates has increased year by year after 2012, reaching US$ 1.29 billion in 2017 (mainland output value, including domestic and oreign capital, global share of 20%). estimated 2018-2022 The annual output value of mainland packaging substrates will maintain a compound growth of more than 12%, and the industry transfer trend is obvious.

China Package Substrate Output Value 2015-2026US$ Million

The packaging process can be divided into the steps of wafer cutting, wafer bonding, gold wire bonding, plastic packaging, laser printing, cutting and bending, inspection and testing.

Semiconductor Packaging Process

According to different substrate materials, package substrates can be divided into BT and ABF.

The BT substrate can avoid leakage current and popcorn phenomenon (impacted by moisture and high temperature) in semiconductor packaging testing.

The ABF material can meet the requirements of fine lines and small line widths in line with advanced semiconductor manufacturing processes. It is suitable for ICs with high pin count and high transmission. It is mostly used in PC products such as graphics chips, processors, and chipsets.

It accounts for about 70% of the global packaging substrate market. Although ABF has great potential, the use of ABF materials requires a large amount of equipment investment, a long customer certification cycle, and a high barrier to entry.

Global Package Substrate Market Size by Material Type

At present, semiconductor packaging is in the third stage of maturity and rapid growth, and it has entered the stage of large-scale production with major packaging forms such as BGA / CSP. At the same time, the fourth technological change with SiP and MCM as the main development direction is at the stage of incubation.

Evolution of Semiconductor Packaging Technology

Package substrate products are diversified. From the perspective of output value distribution, in 2019, package substrates mainly include FCBGA / PGA / LGA, FCCSP, FCBOC and WBPBGA, WB CSP, RF & DigitalModule as the six main products in the package substrate market. Among them, FCBGA / PGA / LGA has a share of approximately 41% at most, and RF & DigitalModule has a minimum of approximately 13%.

Global Package Substrate Market Share by Technology Type

The world’s top ten packaging substrate manufacturers account for more than 80% of the market share, and the industry presents an oligopoly pattern. The top three global companies UMTC, Ibiden, and SEMCO are from Taiwan, Japan, and South Korea, respectively, accounting for 14.78%, 11.19%, and 9.9% of the global market

Global Package Substrate Market Share by Vendor

From the point of view of production, global carrier boards are mainly manufacturers in Taiwan (31%), Japan (20%), and South Korea (28%), accounting for about 80% of the global share.

The package substrate serves as a carrier for chips, and its downstream requirements are highly related to IC chips. The packaging substrate is an important branch of the PCB board, which belongs to the high-end market segment, with high density, high precision, miniaturization and thinness.

It covers various social and economic fields such as communications, industrial medical, aerospace, automotive electronics, and computers. The explosion of related science and technology represented by 5G and the Internet of Things will promote the rapid development of the entire semiconductor industry chain.

Among them, the most important downstream market belongs to the field of communication. In the field of communication equipment and mobile terminals, the demand for packaging substrates accounts for 8.95% and 26.36% of its total PCB demand, respectively.


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Table of Contents –Analysis of Key Points

1 Study Coverage

1.1 Package Substrates Product

1.2 Key Market Segments in This Study

1.3 Key Manufacturers Covered

1.4 Market by Type

1.4.1 Global Package Substrates Market Size Growth Rate by Type

1.4.2 FCCSP

1.4.3 WBCSP

1.4.4 SiP

1.4.5 BOC

1.4.6 FCBGA

1.5 Market by Application

1.5.1 Global Package Substrates Market Size Growth Rate by Application

1.5.2 Mobile Devices

1.5.3 Automotive Industry

1.5.4 Others

1.6 Study Objectives

1.7 Years Considered

2 Executive Summary

2.1 Global Package Substrates Market Size

2.1.1 Global Package Substrates Revenue 2014-2025

2.1.2 Global Package Substrates Production 2014-2025

2.2 Package Substrates Growth Rate (CAGR) 2019-2025

2.3 Analysis of Competitive Landscape

2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)

2.3.2 Key Package Substrates Manufacturers Package Substrates Manufacturing Base Distribution, Headquarters Manufacturers Package Substrates Product Offered Date of Manufacturers Enter into Package Substrates Market

2.4 Key Trends for Package Substrates Markets & Products

3 Market Size by Manufacturers

3.1 Package Substrates Production by Manufacturers

3.1.1 Package Substrates Production by Manufacturers

3.1.2 Package Substrates Production Market Share by Manufacturers

3.2 Package Substrates Revenue by Manufacturers

3.2.1 Package Substrates Revenue by Manufacturers (2014-2019)

3.2.2 Package Substrates Revenue Share by Manufacturers (2014-2019)

3.3 Package Substrates Price by Manufacturers

3.4 Mergers & Acquisitions, Expansion Plans

4 Package Substrates Production by Regions

4.1 Global Package Substrates Production by Regions

4.1.1 Global Package Substrates Production Market Share by Regions

4.1.2 Global Package Substrates Revenue Market Share by Regions

4.2 United States

4.2.1 United States Package Substrates Production

4.2.2 United States Package Substrates Revenue

4.2.3 Key Players in United States

4.2.4 United States Package Substrates Import & Export

4.3 Europe

4.3.1 Europe Package Substrates Production

4.3.2 Europe Package Substrates Revenue

4.3.3 Key Players in Europe

4.3.4 Europe Package Substrates Import & Export

4.4 China

4.4.1 China Package Substrates Production

4.4.2 China Package Substrates Revenue

4.4.3 Key Players in China

4.4.4 China Package Substrates Import & Export

4.5 Japan

4.5.1 Japan Package Substrates Production

4.5.2 Japan Package Substrates Revenue

4.5.3 Key Players in Japan

4.5.4 Japan Package Substrates Import & Export

4.6 South Korea

4.6.1 South Korea Package Substrates Production

4.6.2 South Korea Package Substrates Revenue

4.6.3 Key Players in South Korea

4.6.4 South Korea Package Substrates Import & Export

4.7 Other Regions

4.7.1 Taiwan

4.7.2 India

4.7.3 Southeast Asia

5 Package Substrates Consumption by Regions

6 Market Size by Type

6.1 Global Package Substrates Production by Type

6.2 Global Package Substrates Revenue by Type

6.3 Package Substrates Price by Type

7 Market Size by Application

7.1 Overview

7.2 Global Package Substrates Breakdown Dada by Application

7.2.1 Global Package Substrates Consumption by Application

7.2.2 Global Package Substrates Consumption Market Share by Application (2014-2019)

8 Manufacturers Profiles

8.1 Ibiden

8.1.1 Ibiden Company Details

8.1.2 Company Overview

8.1.3 Ibiden Package Substrates Production Revenue and Gross Margin (2014-2019)

8.1.4 Ibiden Package Substrates Product Description

8.1.5 Ibiden Recent Development

8.2 Shinko Electric Industries

8.2.1 Shinko Electric Industries Company Details

8.2.2 Company Overview

8.2.3 Shinko Electric Industries Package Substrates Production Revenue and Gross Margin (2014-2019)

8.2.4 Shinko Electric Industries Package Substrates Product Description

8.2.5 Shinko Electric Industries Recent Development

8.3 Kyocera

8.3.1 Kyocera Company Details

8.3.2 Company Overview

8.3.3 Kyocera Package Substrates Production Revenue and Gross Margin (2014-2019)

8.3.4 Kyocera Package Substrates Product Description

8.3.5 Kyocera Recent Development

8.4 Samsung Electro-Mechanics

8.4.1 Samsung Electro-Mechanics Company Details

8.4.2 Company Overview

8.4.3 Samsung Electro-Mechanics Package Substrates Production Revenue and Gross Margin (2014-2019)

8.4.4 Samsung Electro-Mechanics Package Substrates Product Description

8.4.5 Samsung Electro-Mechanics Recent Development

8.5 Fujitsu

8.5.1 Fujitsu Company Details

8.5.2 Company Overview

8.5.3 Fujitsu Package Substrates Production Revenue and Gross Margin (2014-2019)

8.5.4 Fujitsu Package Substrates Product Description

8.5.5 Fujitsu Recent Development

8.6 Hitachi

8.6.1 Hitachi Company Details

8.6.2 Company Overview

8.6.3 Hitachi Package Substrates Production Revenue and Gross Margin (2014-2019)

8.6.4 Hitachi Package Substrates Product Description

8.6.5 Hitachi Recent Development

8.7 Eastern

8.7.1 Eastern Company Details

8.7.2 Company Overview

8.7.3 Eastern Package Substrates Production Revenue and Gross Margin (2014-2019)

8.7.4 Eastern Package Substrates Product Description

8.7.5 Eastern Recent Development

8.8 LG Innotek

8.8.1 LG Innotek Company Details

8.8.2 Company Overview

8.8.3 LG Innotek Package Substrates Production Revenue and Gross Margin (2014-2019)

8.8.4 LG Innotek Package Substrates Product Description

8.8.5 LG Innotek Recent Development

8.9 Simmtech

8.9.1 Simmtech Company Details

8.9.2 Company Overview

8.9.3 Simmtech Package Substrates Production Revenue and Gross Margin (2014-2019)

8.9.4 Simmtech Package Substrates Product Description

8.9.5 Simmtech Recent Development

8.10 Daeduck

8.10.1 Daeduck Company Details

8.10.2 Company Overview

8.10.3 Daeduck Package Substrates Production Revenue and Gross Margin (2014-2019)

8.10.4 Daeduck Package Substrates Product Description

8.10.5 Daeduck Recent Development

8.11 AT&S

8.12 Unimicron

8.13 Kinsus

8.14 Nan Ya PCB

8.15 ASE Group

8.16 TTM Technologies

8.17 Zhen Ding Technology

8.18 Shenzhen Fastprint Circuit Tech


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