Lucintel’s latest market report analyzed that OSAT provides attractive opportunities in computer & networking, consumer electronics, industrial electronics, and telecom industries. The OSAT market is expected to reach $32.5 billion by 2025 with a CAGR of 3.7%. In this market, wire bond is the largest segment by packaging type, whereas computer and networking is largest by end use industry. The miniaturization and higher functionality of semiconductors provides strategic growth path in this market.
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Based on packaging type, the OSAT market is segmented into wire bond, flip chip, wafer level. The wire bond segment accounted for the largest share of the market in 2020 and is expected to register the highest CAGR during the forecast period, due to the wire bond packaging is cost effective solution for low to medium pin count applications.
Browse in-depth TOC on “OSAT Market”
132 – Tables
157 – Figures
250 – Pages
The OSAT Market is marked by the presence of several big and small players. Some of the prominent players offering OSAT include ASE, Amkor, JCET, SPIL, and PTI.
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