Market Synopsis:
Hybrid memory cube and high bandwidth are RAM interfaces that are architectured and designed by Silicon Vias, and AMD and Hynix. Both of these products work for stacked DRAM memory. According to an observation presented by Market Research Future (MRFR), It has also been estimated that the valuation of the market can exceed USD 3 Bn mark by 2023.
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High band-width memory has emerged to be more advantageous than the hybrid memory cube as it uses as Graphical Processing Unit (GPU) which is included in the same package as RAM. Hybrid memory cube, on the other hand, uses a separate processor to add to the device’s memory capacity. Key players are investing in product development and technological advancements, which is likely to lead the PROLIFERATION of the hybrid memory cube and high-bandwidth memory market in the years to come.
The products find application in data centers, which is poised to boost the expansion of the market over the next couple of years. Data centers are being widely deployed in organizations to enhance their technical capabilities and increase efficiency. The advantages of data centers are likely to generate massive demand for the same in the foreseeable future. This, in turn, is projected to catapult the hybrid memory cube and high-bandwidth memory market on upward trajectory. In addition, the rising demand for high-end computing devices and smartphones are poised to catalyze growth of the market over the next couple of years due to proliferating applications of these RAM interfaces.
Competitive Dashboard:
The landscape of the global hybrid memory cube and high-bandwidth memory market is characterized by the consolidation of small and established participants. Some of the major players of the market are IBM Corporation (U.S.), Samsung Group (South Korea), Micron Technology, Inc. (U.S.), SK Hynix Inc. (South Korea), Intel Corporation (U.S.), Advanced Micro Devices, Inc. (U.S.), Xilinx, Inc. (US.), Nvidia Corporation (U.S.), Fujitsu Ltd. (Japan), and Open-Silicon (U.S.). Some other players of the hybrid memory cube and high band-width memory market are Cadence Design Systems, Inc. (U.S.), Marvell Technology Group, Ltd. (U.S.), Arira (U.S.), Cray Inc. (U.S.), Arm Holdings (U.K), Rambus Inc. (U.S.), and Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan) among others.
Market Segmentation:
By memory type, the segments of the hybrid memory cube and high-bandwidth memory market include HMC and HBM.
On the basis of product, the hybrid memory cube and high-bandwidth memory market have been segmented into CPU, FPGA, GPU, and ASIC.
On the basis of application areas, the global hybrid memory cube and high-bandwidth memory market have been segmented into HPC, consumer electronics, and networking & telecommunication.
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Regional Analysis:
The geographic evaluation of the global memory cube and high-bandwidth memory market spans across four regions – North America, Europe, Asia Pacific (APAC), and the Rest of the World (RoW). North America is projected to dominate the growth pattern of the market across the assessment period. Increasing deployment of data centers has led to a rapid rise in application of these products in the region. This, in turn, is anticipated to propel the expansion of the regional hybrid memory cube and high-bandwidth memory market in the years to come. The U.S. is anticipated lead the expansion of the market in the region and contribute most significantly towards its growth during the projection period. Increasing concentration of tech startups in the region is also poised to provide impetus to market growth over the next couple of years.
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