According to a new market report published by Lucintel, the future of the high-density interconnect (HDI) PCB market looks promising with opportunities in the smartphone, computer, telecommunication equipment, consumer electronics, and automotive industries. The HDI PCB market is expected to reach an estimated $15.6 billion by 2024 with a CAGR of 8% from 2019 to 2024. The major drivers for this market are growth in consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.
Browse 84 market data tables and 112 figures spread through 196 pages and in-depth TOC on “HDI PCB Market”
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In this market, 4-6 layers, 8-10 layers, and more than 10 layers (10+ layers) HDI PCBs are used in a wide range of electronic components. Lucintel forecasts that 4-6 layers will remain the largest product type due to increasing demand in smartphone and telecommunication equipment. The 10+ layer HDI PCB is expected to witness the highest growth during the forecast period due to the growing demand for smart wearable and connected devices.
Within HDI PCB market, smartphone will remain the largest end use industry due to the increasing demand for high performance PCB and growing demand for more space in smartphones for larger batteries. Automotive is expected to witness the highest growth over the forecast period due to advancement in automotive electronics.
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Asia Pacific will remain the largest market and it is also expected to witness the highest growth over the forecast period due to the increasing electronic content in automotive and growth in consumer electronic devices & telecommunication products.
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Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs. Unimicron, AT&S, Samsung Electro-Mechanics, Tripod, Compeq, Unitech, NOK Corporation, Zhen Ding Technology, Flexium Interconnect, Fujikura, Nitto Denko, and Young Poong Electronics are among the major manufacturers of HDI PCBs.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the HDI PCB market by end use industry, technology, buildup layer count, and region. Lucintel has prepared a comprehensive research report entitled “Growth Opportunities in the HDI PCB Market 2019-2024: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the HDI PCB market by end use industry, by technology, by build-up layer count, and region as follows:
By End Use Industry [$M and Thousand Sqm shipment analysis for 2013 – 2024]:
- Telecommunication Equipment
- Consumer Electronics
By Product [$M and Thousand Sqm shipment analysis for 2013 – 2024]:
- 4-6 Layer
- 8-10 Layer
- 10+ Layer
By Build-up layer count [$M and Thousand Sqm shipment analysis for 2013 – 2024]:
By Region [$M and Thousand Sqm shipment analysis for 2013 – 2024]:
- North America
– United States
- Asia Pacific
– South Korea
- Rest of the World
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This 196-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/high-density-interconnect-printed-circuit-board-market.aspx or firstname.lastname@example.org
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com
This report answers following 11 key questions:
Q.1 What are some of the most promising potentials, high-growth opportunities for the HDI PCB market by end-use industry (smartphone, computer and tablets, telecommunication, consumer electronics, automotive and others), technology (4-6 Layer, 8-10 Layer, 10+ Layer), build-up layer count (1+n+1,2+n+2,3+n+3, any layer), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the market?
Q.6 What are emerging trends in this market and the reasons behind them?
Q.7 What are some changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities have taken place in the last 5 years in this market?
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