Flip Chip Technology Market 2019
Description: –
The flip chip technology industry is expected to flourish at an exceptionally good rate in the forecast period. The study predicts the future of the industry based on information about past trends, upcoming patterns in the flip chip technology industrial area influenced by the positive and negative components. Flip chip technology which is also called controlled collapse chip connection and is a process for attaching various semiconductor devices, such as IC chips and MEMS, to external circuitry with fuse bulges that have been accumulated on the chip pads.
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Major Key Players
• Samsung Group (South Korea)
• Intel Corporation (U.S.)
• Global Foundries (U.S.)
• UMC (Taiwan)
• ASE, Inc. (Taiwan)
• Amkor Technology (U.S.)
• STATS ChipPAC (Singapore)
• Powertech Technology (Taiwan)
• STMicroelectronics (Switzerland)
• Texas Instruments (U.S.)
Rising demand for wearable devices such as smartphones is driving the flip chip technology market as it is broadly used in several revved up applications to fulfill the demands of the electronics industry and hence, is a huge motivator for the flip chip technology industry. Powerful growth in MMIC which is also called as monolithic microwave IC is promoting the industry as MMIC are gadgets that work at several microwave frequencies and execute functions such as microwave mixing, power amplification and high frequency switching which improves the range of functions that the flip chips can perform. The flourishing smartphone industry is also indirectly motivating the flip chip technology industrial organizations. Higher costs linked with the technology is restricting the growth of the global flip chip technology industry.
Market Segmentation:
The flip chip technology market is fragmented based on wafer bumping process, end user, packaging technology and product. The flip chip technology market is divided based on wafer bumping process as copper pillar, lead free solder and gold stud bumping. The flip chip technology market is divided based on packaging technology as CSP and BGA (2.5D/2.1D/3D). The market is fragmented based on product as memory, light emitting diode, SoC, CPU, CMOS image sensor and GPU. The market is segmented based on military and defense, industrial, medical and healthcare, consumer electronics, automotive and telecommunications.
Regional Analysis:
Territorially, the market is divided into China, Taiwan, South Korea, United States, Malaysia, Singapore and Japan. The APAC (Asia Pacific) region is expected to grow at the highest rate when compared to other regions owing to the higher presence of technology companies and the automotive industry in the region. Furthermore, the countries in this region such as China and India are growing at a good rate owing to high economic activity, greater population size and rising disposable income. The smartphone industry is also expected to grow at a substantial rate in the coming years which also propels the growth of flip chip technology market.
Industry News:
November 2019: TriLumina which is the major developer of flip chip technology for 3D sensing launched world’s first 3W surface mount, back emitting, flip chip VCSEL array. The new VCSEL on board (VoB) technology facilitates higher performance, lower costs and smaller size and untangle time of flight camera supply chains as compared to conventional VCSELs for 3D sensing.
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Table of Contents – Major Key Points
1 Executive Summary
2 Scope Of The Report
3 Market Research Methodology
4 Market Landscape
5 Industry Overview Of Global Flip Chip Technology Market
6 Market Trends
7. Global Flip Chip Technology Market By Wafer Bumping Process
8. Global Flip Chip Technology Market By Packaging Technology
Continued…
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