Overview:
As per the latest study conducted by Market Research Future (MRFR), the global flexible printed circuit board market is likely to surpass a valuation of USD 27,900 Mn by the year 2023. Increased investment in miniaturization of electronic devices has result in a significant uptick in demand for flexible circuit boards. These boards are the outcome of consistent effort towards enhancing circuit board systems. They are being increasingly used in electronic devices across automotive, healthcare, consumer electronics among others.
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Flexible printed circuit board also known as flexible PCBs, flexible circuits and flex circuit. They are used in circuitry and rigid printed components. The material used for making such board have special characteristics that offer suppleness to the finished product. The growing demand for consumer electronics and penetration of smart devices such as mobile phones and smartwatches. Also, increased adoption of flexible displays in a range of electronic products has also boosted the market prospects of flexible printed circuited boards. At the same time, integration of flexible-circuit laminates and thermal performance in electronic devices opening new windows of opportunities for flexible printed circuit boards.
Key Players:
Some of the major players in Global Flexible Printed Circuit Board Market include 3M company (U.S.), BHflex co. Ltd. (South Korea), Flexible Circuit technology (U.S.), Sumitomo Electric industries (Japan), Fujikura (Japan), Daeduck GDS Co. Ltd. (South Korea), Career technology co. ltd. (Taiwan), Flexcom Ltd. (South Korea), Interflex Co. Ltd. (South Korea), Orbotech Ltd. (Israel) and Zhen ding Technologies (Taiwan) among others.
Flexible Printed Circuit Board Global Market – Segmentation
MRFR’s report includes an exhaustive segmental analysis of the market based on application area, type and region. By application area, the market has been segmented into aerospace & defense, automotive, consumer electronics, medical devices, wearables, and others. The consumer electronics segment is likely to hold its dominant position beyond 2019. The segment is currently valued at over USD 5,300 Mn. The growth of the segment can be primarily attributed to the widespread application of flexible circuits in electronic components such as laptops, printers, television sets, smartphones, and tablets. The manufacturing segment holds the second position and is expected to witness 11.7% CAGR till 2023. By type, the market has bees segmented into single-sided flex, double-sided flex, rigid flex and multilayer flex. The multilayer flex segment currently commands more that one-third share of the market. The segment stood at a market valuation in excess of the USD 5,200 Mn in 2017 and is project to grow at above-average pace over 2023. Multi-layer flex circuits are highly advanced circuit system and find significant application opportunities in the aerospace & defense sector.
Flexible Printed Circuit Board Global Market – Regional Analysis
Key regions covered in the report include Asia Pacific, North America, Europe, the Middle East & Africa (MEA) and Latin America. During the assessment period, Asia Pacific is expected to remain the largest market for flexible printed circuit boards. The region currently commands more than 50% share of the market. In 2017, the market in the region was valued at USD 7,443.14 Mn and is projected to witness a 12.2% CAGR over the assessment period. Various APAC countries including China, Taiwan and South Korea have emerged a major contributor to the global substrate supplies. Due to various macro and microeconomic factors, many of the APAC countries have become a hot investment destination for manufacturers. China is one of largest electronics manufacturing hub of the world. This gives the region an edge in the global flexible printed circuit board market. North America is likely to retain its second spot in the global market. The market in the region is currently valued over USD 3,300 Mn and set to capture the highest CAGR during the assessment period.
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Intended Audience
- Semiconductor manufacturers
- Professional Services/Solutions Providers
- Research Organizations
- Associations, Forums, and Alliances
- Technology Integrators
- OEM Manufacturers
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