Molded Interconnect Device Market in APAC to hit US$400mn by 2024

Molded interconnect device (MID) market in China is set to surpass USD 155 million by 2024 due to rapid demand for MIDs in consumer electronics applications.
Global MID Market By End-Use (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication & Computing), By Process (Laser Direct Structuring (LDS), Two-Shot Molding), Industry Analysis Report, Regional Outlook (U.S., Canada, UK, Germany, France, Spain, Italy, Sweden, Russia, China, India, Japan, South Korea, Taiwan, Malaysia, Australia, Brazil, Mexico, Saudi Arabia, UAE, South Africa), Application Potential, Competitive Market Share & Forecasts to 2024

The world forecast report says, “Molded Interconnect Device Market is predicted to be valued USD 840 million by 2024. The proliferation of the smart & connected wearable devices across the globe is driving the industry growth. These components allow lesser energy consumption and help in enhancing the battery life of the wearable devices, which is beneficial to the users. Moreover, these components further help in reducing the overall of the wearable devices. The wearables are increasingly being consumed in medical activities to detect the patient’s heart rate, body temperature, and the blood level on a regular basis, which is anticipated to drive the molded interconnect device market.

The surge in the use of consumer electronic devices including smartphones, tablets, and televisions is anticipated to drive the molded interconnect device (MID) market share. These components are increasingly integrated into the smart devices owing to their reduced size and energy-saving features. The antenna integrated components provide enhanced mechanical and electronic enclosure development to the manufacturers.

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The incorporation of the components into the smartphone devices helps in improving the functionality and productivity. They help in minimizing the total parts in a circuit, thereby reducing the assembly time, saving space, and reducing costs for intricated functions, which are projected to drive the implementation and usage of the components in several applications.

In the molded interconnect device market, the Laser Direct Structuring (LDS) process segment is anticipated to gain traction over the coming years owing to the ease of processing and low development & tooling costs associated with the manufacturing processes. It consists of a one-step process that integrates plastic creation on the device and enhances the component performance. The molded interconnect devices market is driven by benefits provided by the LDS processes such as the elimination of hazardous chemical pre-treatment and lesser environmental impacts over the legacy processes.

The healthcare sector in the molded interconnect device market is predicted to dominate owing to the growing use of these components in devices such as blood pressure monitors, glucose meters, and oxygen meters that enables improved patient diagnostics. The 3D assemblies of components in medical devices help in enhancing the circuit designs and minimizing the size. These are increasingly being used by dentists and medical pathology labs, thereby driving the molded interconnect device (MID) market growth.

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In the Asia Pacific molded interconnect device market, countries including China, Japan, and South Korea are expected to witness several growth opportunities owing to the presence of major consumer electronics manufacturers. These components enable ease of processing and low energy consumption thereby benefiting the manufacturing companies. Growth in the disposable income and increased spending capacity of consumers in the Asia Pacific region are further providing an impetus to the molded interconnect devices market growth. Penetration and presence of several raw material suppliers and the growth in the export activities from these countries account for large revenue shares in the industry.

Players operating in the molded interconnect devices (MID) market include Molex, TE Connectivity, Harting Mitronics AG, SelectConnect Technologies, RTP Company, MacDermid Enthone, LPKF Laser & Electronics, Galtronics, Multiple Dimensions AG, Teprosa GmbH, Yomura, and Suzhou Cicor Technology Co., Ltd. Manufacturers in the industry are focusing on minimizing the component size to cater to the consumer segment demands. Several major players are incorporating strategic alliances and partnerships with consumer electronics manufacturers for supplying raw materials in bulk quantities.

Buy this industry insights spread across 210 pages with 155 market data tables & 36 figures & charts from the report, “Molded Interconnect Devices (MID) Market Size By Process (Laser Direct Structuring (LDS), Two-Shot Molding) By End-Use (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication & Computing), Industry Analysis Report, Regional Outlook (U.S., Canada, UK, Germany, France, Spain, Italy, Sweden, Russia, China, India, Japan, South Korea, Taiwan, Malaysia, Australia, Brazil, Mexico, Saudi Arabia, UAE, South Africa), Application Potential, Competitive Market Share & Forecast, 2018 – 2024” in detail along with the table of contents:

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Table of Contents (ToC) of the report:

Chapter 5.   MID Market, By End-Use

5.1.  Key trends by end-use

5.2.  Automotive

5.2.1. Market estimates and forecast, 2013-2024

5.2.2. Market estimates and forecast, by process 2013 – 2024

5.2.3. Market estimates and forecast, by region 2013 – 2024

5.3.  Consumer products

5.3.1. Market estimates and forecast, 2013-2024

5.3.2. Market estimates and forecast, by process 2013 – 2024

5.3.3. Market estimates and forecast, by region 2013 – 2024

5.4.  Healthcare

5.4.1. Market estimates and forecast, 2013-2024

5.4.2. Market estimates and forecast, by process 2013 – 2024

5.4.3. Market estimates and forecast, by region 2013 – 2024

5.5.  Industrial

5.5.1. Market estimates and forecast, 2013-2024

5.5.2. Market estimates and forecast, by process 2013 – 2024

5.5.3. Market estimates and forecast, by region 2013 – 2024

5.6.  Military & aerospace

5.6.1. Market estimates and forecast, 2013-2024

5.6.2. Market estimates and forecast, by process 2013 – 2024

5.6.3. Market estimates and forecast, by region 2013 – 2024

5.7.  Telecommunication & computing

5.7.1. Market estimates and forecast, 2013-2024

5.7.2. Market estimates and forecast, by process 2013 – 2024

5.7.3. Market estimates and forecast, by region 2013 – 2024

5.8.  Others

5.8.1. Market estimates and forecast, 2013-2024

5.8.2. Market estimates and forecast, by process 2013 – 2024

5.8.3. Market estimates and forecast, by region 2013 – 2024

Browse Full Table of Contents (ToC) @ https://www.gminsights.com/toc/detail/molded-interconnect-devices-MID-market

 

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