{"id":843117,"date":"2026-10-21T23:40:02","date_gmt":"2026-10-21T23:40:02","guid":{"rendered":"https:\/\/www.abnewswire.com\/pressreleases\/?p=843117"},"modified":"2026-10-21T23:40:02","modified_gmt":"2026-10-21T23:40:02","slug":"ybs7500-fluorinated-fluid-advances-as-direct-replacement-for-3m-novec-7500-in-semiconductor-etching-applications","status":"publish","type":"post","link":"https:\/\/www.abnewswire.com\/pressreleases\/ybs7500-fluorinated-fluid-advances-as-direct-replacement-for-3m-novec-7500-in-semiconductor-etching-applications_843117.html","title":{"rendered":"YBS-7500 Fluorinated Fluid Advances as Direct Replacement for 3M\u2122 Novec\u2122 7500 in Semiconductor Etching Applications"},"content":{"rendered":"
Engineered to mitigate supply chain risks ahead of 3M\u2019s 2026 phaseout, YBS-7500 delivers matching thermal performance, enhanced electrical insulation, and significant cost savings for electrostatic chuck temperature control systems.<\/div>\n

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DongGuan, China – October 21, 2026 – <\/strong> As global semiconductor manufacturers face the impending discontinuation of 3M’s Novec™ product portfolio by the end of 2026, YBS has introduced YBS-7500, an advanced domestically manufactured fluorinated fluid engineered as a direct, drop-in replacement for 3M™ Novec™ 7500. A prominent semiconductor manufacturing and equipment company has successfully completed technical benchmarking and initiated on-tool sample validation of YBS-7500 in the temperature control circulation system of an electrostatic chuck (ESC) used in high-precision etching equipment.<\/p>\n

The transition addresses two mounting vulnerabilities confronting the semiconductor fabrication sector: supply uncertainty triggered by the scheduled exit of the legacy fluid manufacturer, and steep procurement costs. Prior to the project, the customer relied on 3M™ Novec™ 7500, consuming approximately 170 kg per batch at an average cost of RMB 600 per kilogram; equating to roughly RMB 102,000 per fluid replacement. With market prices steadily climbing and product availability dwindling ahead of the 2026 sunset date, adopting a reliable domestic alternative has become a strategic priority for maintaining wafer fabrication continuity and stabilizing operational expenses.<\/p>\n

Overcoming High-Precision Etch Challenges<\/strong><\/p>\n

The project, titled Domestic Replacement of Thermal Transfer Fluid for the Temperature Control Circulation System of Semiconductor Etching Equipment<\/em>’s Electrostatic Chuck (ESC), <\/em>focused on qualifying a thermal management medium capable of operating under demanding wafer-processing conditions.<\/p>\n

Semiconductor etching processes require stringent thermal uniformity across the wafer surface, operating within a target window of 60°C to 80°C. Any variation in fluid properties can alter heat transfer dynamics, introduce hot spots, and compromise etching fidelity. Furthermore, because thermal transfer fluids in ESC circuits run adjacent to high-voltage chuck assemblies and withstand corrosive processing environments, any viable substitute must satisfy exacting thermal, dielectric, and chemical compatibility criteria.<\/p>\n

Following rigorous technical screening against the customer’s parameters, YBS-7500 achieved near-identical or superior metrics across all baseline categories.<\/p>\n

Technical Benchmarking and Performance Advantages<\/strong><\/p>\n

YBS-7500 is formulated from high-purity perfluoropolyether (PFPE) compounds and perfluoropolymers, delivering the stability and inertness demanded by advanced advanced semiconductor processing:<\/p>\n