{"id":649198,"date":"2023-04-26T18:16:01","date_gmt":"2023-04-26T18:16:01","guid":{"rendered":"https:\/\/www.abnewswire.com\/pressreleases\/?p=649198"},"modified":"2023-04-26T18:16:01","modified_gmt":"2023-04-26T18:16:01","slug":"3d-ic-market-is-expected-to-reach-181-billion-by-2028-an-exclusive-market-research-report-by-lucintel","status":"publish","type":"post","link":"https:\/\/www.abnewswire.com\/pressreleases\/3d-ic-market-is-expected-to-reach-181-billion-by-2028-an-exclusive-market-research-report-by-lucintel_649198.html","title":{"rendered":"3D IC Market is expected to reach $18.1 Billion by 2028 – An exclusive market research report by Lucintel"},"content":{"rendered":"
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Trends and Forecast for the 3D IC Market<\/div>\n<\/div>\n<\/div>\n
Trends, opportunities, and forecast for the global 3D IC market from 2017 to 2028 by product (stacked 3D and monolithic 3D), component (through-silicon via (TSV), through glass via (TGV), and silicon interposer), application (logic, imaging & optoelectronics, memory, mems\/sensors, and led), end use industry (consumer electronics, telecommunication, automotive, military & aerospace, medical devices, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)<\/div>\n

Lucintel’s latest market report analyzed that 3D IC<\/a> provides attractive opportunities in the consumer electronics, telecommunication, automotive, military & aerospace, medical device, and industrial markets. The 3D IC market is expected to reach $18.1 billion by 2028 with a CAGR of 25.0%. In this market, stacked 3D is the largest segment by product, whereas consumer electronics is largest by end use industry.<\/p>\n

Download Brochure<\/strong> of this report by clicking on https:\/\/www.lucintel.com\/3d-ic-market.aspx<\/a><\/p>\n

Based on product, the 3D IC market is segmented into stacked 3D and monolithic 3D. The stacked 3D segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to because it is highly demanded in AI, machine learning, and data center products.<\/p>\n

Browse in-depth TOC on “3D IC Market”<\/p>\n

100 – Figures\/Tables<\/p>\n

150 – Pages<\/p>\n

The 3D IC Market is marked by the presence of several big and small players. Some of the prominent players offering 3D IC include United Microelectronics Corporation, Tezzaron Semiconductor, 3M, IBM Corporation, Xilin, Monolithic 3D, Intel Corporation, Toshiba Corp, Amkor Technology, Samsung Electronic.<\/p>\n

Request Sample Report:<\/strong><\/p>\n

https:\/\/www.lucintel.com\/3d-ic-market.aspx<\/a><\/p>\n

This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link helpdesk@lucintel.com<\/a>.<\/p>\n

About Lucintel<\/strong><\/p>\n

Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis<\/a>, growth consulting<\/a>, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com<\/a>.<\/p>\n

Roy Almaguer <\/em>Lucintel Dallas, Texas, USA Email: roy.almaguer@lucintel.com<\/a>  Tel. 972.636.5056<\/p>\n

Media Contact<\/span>
Company Name:<\/strong> Lucintel<\/a>
Contact Person:<\/strong> Roy Almaguer
Email:<\/strong> Send Email<\/a>
Phone:<\/strong> 972.636.5056
Address:<\/strong>8951 Cypress Waters Blvd., Suite 160
City:<\/strong> Dallas
State:<\/strong> TEXAS
Country:<\/strong> United States
Website:<\/strong> https:\/\/www.lucintel.com\/<\/a><\/p>\n

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Trends and Forecast for the 3D IC Market Trends, opportunities, and forecast for the global 3D IC market from 2017 to 2028 by product (stacked 3D and monolithic 3D), component (through-silicon via (TSV), through glass via (TGV), and silicon interposer), … Continue reading →<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[408,449,417,411,416],"tags":[],"class_list":["post-649198","post","type-post","status-publish","format-standard","hentry","category-Electronics-Semiconductors","category-Gaming","category-Marketing-Sales","category-Technology","category-World"],"_links":{"self":[{"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/posts\/649198","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/comments?post=649198"}],"version-history":[{"count":0,"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/posts\/649198\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/media?parent=649198"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/categories?post=649198"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/tags?post=649198"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}