{"id":54238,"date":"2016-02-29T11:12:02","date_gmt":"2016-02-29T11:12:02","guid":{"rendered":"http:\/\/www.abnewswire.com\/pressreleases\/?p=54238"},"modified":"2016-02-29T11:12:02","modified_gmt":"2016-02-29T11:12:02","slug":"system-in-package-industry-sip-global-trends-technology-development","status":"publish","type":"post","link":"https:\/\/www.abnewswire.com\/pressreleases\/system-in-package-industry-sip-global-trends-technology-development_54238.html","title":{"rendered":"System in Package Industry (SiP) Global Trends & Technology Development"},"content":{"rendered":"
ReportsWeb.com adds a research on \u201cGlobal Trends in SiP Technology Development\u201d to its vast collection of latest reports under its Technology section. The report covers SIP Technology, Applications, Development, market size and 2016 forecasts.<\/div>\n

Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises.<\/p>\n

With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology.<\/p>\n

This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.<\/p>\n

Companies covered <\/strong>under this research are Amkor, AppleASE, ChipPAC, Inotera Memories, JCET, Kansu, Nan Ya PCBSPIL, TAM, TDK, Unimicron and USI.<\/p>\n

Browse complete research spread across 18 pages at:
<\/strong>http:\/\/www.reportsweb.com\/global-trends-in-sip-technology-development<\/a><\/p>\n


Table of Contents:<\/strong><\/p>\n

1. Global Development of SIP Technology<\/p>\n

1.1 High Levels of Integration and Miniaturization Drive SiP Development<\/p>\n

1.2 SiP\/Module Design Bundles for Diverse Development<\/p>\n

1.3 Entry Barriers to SiP Remain High<\/p>\n

2. Development of Global SiP Market Applications<\/p>\n

2.1 Smartphones as Key Growth Driver for SiP<\/p>\n

2.2 Mobile Devices, Wearables, and IoT Continue to Spur Demand for SiP<\/p>\n

3. Development of the Global SiP industry<\/p>\n

3.1 Packaging and Testing Service Providers Make Aggressive Move Towards SiP<\/p>\n

3.2 IC Substrate Makers Also Extend Reach to SiP<\/p>\n

3.3 Foundries Aim for Turnkey Services with SiP<\/p>\n

4. Conclusion<\/p>\n

List of Companies<\/p>\n

List of Figures<\/strong><\/p>\n

Figure 1: How SiP Boosts Levels of Integration and Miniaturization<\/p>\n

Figure 2: Major SiP Packaging Technologies<\/p>\n

Figure 3: Use of SiP Modules in Smartphones<\/p>\n

Figure 4: Global SiP Shipment Value and Growth, 2013-2016<\/p>\n

Figure 5: Cooperation and Competition Between Foundries and Packaging and Testing Service Providers<\/p>\n

Place a DIRECT PURCHASE<\/strong> order of Global Trends in SiP Technology Development<\/strong> (USD 1600 – Single User PDF copy) at:
http:\/\/www.reportsweb.com\/buy&RW00020105\/buy\/1600<\/a><\/p>\n

For any queries regarding this research, can be placed at:
http:\/\/www.reportsweb.com\/inquiry&RW00020105\/buying<\/a><\/p>\n

Media Contact<\/span>
Company Name:<\/strong> ReportsWeb
Contact Person:<\/strong> Rajat Sahni
Email:<\/strong> sales@reportsweb.com
Phone:<\/strong> +1-646-491-9876
Country:<\/strong> United States
Website:<\/strong> http:\/\/www.reportsweb.com\/global-trends-in-sip-technology-development<\/a><\/p>\n

<\/object><\/p>\n

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ReportsWeb.com adds a research on \u201cGlobal Trends in SiP Technology Development\u201d to its vast collection of latest reports under its Technology section. The report covers SIP Technology, Applications, Development, market size and 2016 forecasts. Under the global trends where electronic … Continue reading →<\/span><\/a><\/p>\n","protected":false},"author":0,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[401],"tags":[],"class_list":["post-54238","post","type-post","status-publish","format-standard","hentry","category-Business"],"_links":{"self":[{"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/posts\/54238","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/types\/post"}],"replies":[{"embeddable":true,"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/comments?post=54238"}],"version-history":[{"count":0,"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/posts\/54238\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/media?parent=54238"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/categories?post=54238"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.abnewswire.com\/pressreleases\/wp-json\/wp\/v2\/tags?post=54238"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}