Semiconductor Packaging Material Market Global Market – Overview
Semiconductor packaging materials plays an important role in the providing safety to the IC chips from the surrounding environment, safeguarding electrical connection for chip mount on printed wiring boards (PCB). There is an increase in the concern for environment safety, because most of the consumers, today are concerned about the impact of packaging on the environment and also much of the common packaging found in households is already harmful to the environment. The semiconductor packaging materials is important in order to protect the material for damaging. Protective packaging products are designed to protect the goods from different types of damages such as atmospheric, magnetic, electrostatic, vibration or shock. Semiconductor packaging includes different types of boxes or storage container, liners and spacers. There is an increase in demand for Semiconductor packaging material because they are widely used in online shopping industry. The growth of semiconductor packaging material industry is also because of the growth in the e-commerce industry. The growing trend of internet shopping, all over the world signifies the need for protective packaging, which prevents damages while transportation or storing the products.
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There has been rapid development in the mobile and telecommunication industry including mobile phones, digital products, memory devices, and others. This development has contributed to boost the specific requirement for making the packaging further smaller, lighter and thinner packaging materials. The electronic sector has been increasingly driven by the higher consumer spending because electronic products requires high performance and speed. Semiconductor devices are thinned, die attached, and encapsulated, in which materials plays an important role. There are various type of materials used in semiconductor packaging materials such as organic substrates, bonding wires, encapsulation resins, ceramic packages, solder balls, wafer level packaging dielectrics and others. Different technologies have been used in order to protect the semiconductor materials such as grid array, small outline package, dual flat no-leads, quad flat package, dual in-line package and others.
In developing countries such as China, India, Indonesia, Thailand, Vietnam, and Mexico is having largest disposable income, due to which there is a significant growth in the manufacturing and service industry. The higher disposable income in these developing countries results in the increase in purchasing power. As a result semiconductor packaging materials market has been impacted positively.
The global semiconductor packaging material market is expected to grow at a CAGR of 5% during the forecast period.
Industry/ Innovation/ Related News:
The key strategies followed by most companies within the global semiconductor packaging material market are that of new product development.
In June 2016, TransPAk has acquired 2XL in order to expand their semiconductor services that will provide expertise in moving, storing, and shipping valuable materials.
On Jan 2017, AGC Asahi Glass has developed an innovative glass substrate for semiconductor packaging. The advanced packaging technology are benefited from the AGC products. Wafer-level packaging (WLP) technology has been used in IC packaging which has made a remarkable progress with next generation devices.
Henkel AG, Hitachi Chemical, Sumitomo Chemical, Kyocera Chemical, Mitsui High-Tec, Toray Industries Corporation, Alent PLC, LG Chemical, TransPAk, AGC Asahi Glass and others and others are some of the prominent players profiled in MRFR Analysis and are at the forefront of competition in the global Semiconductor Packaging Material market.
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Semiconductor Packaging Material Market – Segmentation
The Global Semiconductor Packaging Material Market is segmented in to 3 key dynamics for the convenience of the report and enhanced understanding;
Segmentation by Types : Comprises organic substrates, bonding wires, encapsulation resins, ceramic packages, solder balls, wafer level packaging dielectrics and others
Segmentation by Technology : Comprises grid array, small outline package, dual flat no-leads, quad flat package, dual in-line package and others
Segmentation by Regions : Comprises Geographical regions – North America, Europe, APAC and Rest of the World.
Semiconductor Packaging Material Market: Regional Analysis
In China, the electronics and appliance retailers dominate the market. The domestic manufacturer are accounting for the increase in share of consumer electronics due to growing brand reputation and improved technology. China accounts for about 53.2 % of internet penetration in Asia-Pacific and is expected to grow during the forecast period. Consumer electronics and small appliances are two well established categories in e-commerce. Due to innovation in technology, there has been increase in the semiconductor packaging. The growth factors for e-commerce in Japan are Mobile commerce, Low-cost delivery, and internet penetration and loyalty points. Due to smartphone, the consumer go online, communicate, play media and read e-books, thus there is an increase in buying of wide range of consumer electronics. This will lead to the growth of the Asia Pacific region in semiconductor packaging material market. U.S. is expected to dominate the market in North America due to high satisfaction of online retail. The growing trend in e-commerce market in U.S. is because of the rise in mobile shopping. It is expected that approximately 136 million users have made one purchase through mobile app. In 2016, about 77 percent of internet user had made online purchase in U.S. this increase in the penetration of the online products will result in the growing use of packaging. This will result in the growth of the semiconductor packaging material industry.
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Table Of Contents
1 Executive Summary
2 Scope Of The Report
2.1 Market Definition
2.2 Scope Of The Study
2.2.2 Research Objective
2.3 Research Type
2.3.1 Primary Research
2.3.2 Secondary Research
2.4 Market Size Estimation
2.5 Forecast Model
3 Market Landscape
3.1 Porter’s Five Forces Analysis
3.1.1 Threat Of New Entrants
3.1.2 Bargaining Power Of Buyers
3.1.3 Threat Of Substitutes
3.1.4 Segment Rivalry
3.1.5 Bargaining Power Of Buyers
3.2 Value Chain/Supply Chain Analysis
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