Semiconductor Assembly Equipment Market – Global Industry Analysis, Size, Share, Trends, Growth and Forecast 2018 – 2022

Global Semiconductor Assembly Equipment Market 2018
Wiseguyreports.Com Publish New Market Research Report On -“Semiconductor Assembly Equipment Market – Global Industry Analysis, Size, Share, Trends, Growth and Forecast 2018 – 2022”

Semiconductor Assembly Equipment Market 2018

Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. Chip assembly basically involves attaching or joining two or more semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used for making interconnects between an IC or any other semiconductor device during assembly. This connection ensures the flow of electricity in the semiconductor device.

The analysts forecast the global semiconductor assembly equipment market to grow at a CAGR of 3.57% during the period 2017-2021.

Covered in this report 
The report covers the present scenario and the growth prospects of the global semiconductor assembly equipment market for 2017-2021. To calculate the market size, the report considers the sales of assembly equipment to end-users.

The market is divided into the following segments based on geography: 
• Americas 
• APAC 
• EMEA

 

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The report, Global Semiconductor Assembly Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors 
• ASM Pacific Technology 
• Kulicke & Soffa Industries 
• Palomar Technologies 
• Tokyo Electron 
• Tokyo Seimitsu 

Other prominent vendors 
• Besi 
• ChipMOS TECHNOLOGIES 
• DIAS Automation 
• Greatek Electronics 
• Hesse Mechatronics 
• Hybond 
• Shinkawa 
• Toray Engineering 
• West•Bond

Market driver 
• Incentives and discounts for long-term customers 
• For a full, detailed list, view our report

Market challenge 
• High-investment market 
• For a full, detailed list, view our report

Market trend 
• Growing use of 3D packaging technology 
• For a full, detailed list, view our report

Key questions answered in this report 
• What will the market size be in 2021 and what will the growth rate be? 
• What are the key market trends? 
• What is driving this market? 
• What are the challenges to market growth? 
• Who are the key vendors in this market space? 
• What are the market opportunities and threats faced by the key vendors? 
• What are the strengths and weaknesses of the key vendors?

 

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Table of Contents –Analysis of Key Points

PART 01: Executive summary 
PART 02: Scope of the report 
PART 03: Research Methodology 

PART 04: Introduction 
• Key market highlights 

PART 05: Technology overview 
• Overview of semiconductor assembly equipment 

PART 06: Market landscape 
• Semiconductor assembly equipment market: Overview 
• Market size and forecast 
• Five forces analysis 

PART 07: Market segmentation by type 
• Global semiconductor assembly equipment market by type 
• Global semiconductor assembly equipment market by die bonding equipment 
• Global semiconductor assembly equipment market by inspection and dicing equipment 
• Global semiconductor assembly equipment market by packaging equipment 
• Global semiconductor assembly equipment market by wire bonding equipment 
• Global semiconductor assembly equipment market by plating equipment 

PART 08: Market segmentation by end-user 
• Global semiconductor assembly equipment market by end-user 
• Global semiconductor assembly equipment market by OSATs 
• Global semiconductor assembly equipment market by IDMs 

PART 09: Geographical segmentation 
• Global semiconductor assembly equipment market by geography 
• Semiconductor assembly equipment market in APAC 
• Semiconductor assembly equipment market in Americas 
• Semiconductor assembly equipment market in EMEA 

PART 10: Key leading countries 
• Global semiconductor assembly market: Key leading countries 
• Taiwan 
• South Korea 
• Japan 
• China 

PART 11: Decision framework 
PART 12: Drivers and challenges 
• Market drivers 
• Impact of drivers on key customer segments 
• Impact of drivers on key customer segments 
• Market challenges 
• Impact of challenges on key customer segments 

PART 13: Market trends 
• Growing use of 3D packaging technology 
• Increase in number of OSAT vendors 
• M&A in packaging and assembly market 
• Advent of FOWLP technology 
• Automation in automobiles 
• Increased need for semiconductor memory devices 

PART 14: Vendor landscape 
• Competitive scenario 
• Major vendors 

Continued…..

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