QFN (Quad-Flat-No-Lead )Packaging Market 2025 with Focus on Emerging Technologies, Global Trends, Competitive Landscape, Regional Analysis & Forecasts

The Quad Flat No Leads package, or QFN is a small square-shaped or rectangular surface-mount plastic package with no leads. The QFN has no leads and includes shorter bond wire lengths it exhibits less inductance than leaded packages and therefore provides a higher electrical performance. The QFN package also includes an exposed thermal pad at the package bottom to facilitate heat dissipation from the die.

According to a new report published by Reports Monitor titled, “QFN Packaging Market by Type, Property & Applications: Global Opportunity Analysis and Industry Forecast, 2017–2025,” the QFN Packaging Market was valued at XX million in 2016 and is projected to reach at XX million by 2025, growing at a CAGR of XX% from 2017 to 2025. Asia Pacific dominates the QFN Packaging Market, both in terms of volume and value, and is expected to maintain this trend throughout the forecast period.

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Flat no-leads are a surface-mount technology. Flat no-leads packages for instance quad-flat no leads(QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. It is also known as micro lead frame (MLF) and SON (small-outline no leads). Flat no leads are one of several package technologies which connect ICs to the surfaces of PCBs without through-holes. The QFN package also includes an exposed thermal pad at the package bottom to facilitate heat dissipation from the die. 

The QFN packaging market is increasing due to various driving factors such as increased reliability on wireless applications, growing adoption of portable devices, small form factor, good thermal performance, and increasing applications in the automobile sector. The car manufacturer provides the accessories such as keyless locks and unlock systems for car doors. These devices may boost the demand for QFN package. 

On the basis of segmentation, the market is divided by type, by application, by QFN variants, and by region. According to the type the market is divided into air-cavity QFNs and plastic molded QFNs. According to the application, the market is bifurcated into portable devices, radio frequency (RF), wearable devices, and others. There are different QFN variants such as very thin quad flat no-lead (VQFN), ultrathin quad flat no-lead (UQFN), quad flat no-lead(QFN), and others. 

Key Question Answered:

• What will be the market size in 2025 and at what rate it will grow?

• Who are the major key players in global QFN packaging market and what are their strategies?

• Which vertical industry is expected to show major growth?

• What segment and region will lead the market and why?

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The major companies profiled in the report include: Amkor Technology, ASE Group, Fujitsu Ltd, Linear Technology Corporation, Microchip Technology Inc, NXP Semiconductor, STATS ChipPAC Pte. Ltd, Texas Instruments, Toshiba Corporation, UTAC Group, and others. 

The report has been categorized in two distinctive sections, where the first category titled as Market Overview provides a holistic view of the market, key trends, drivers, challenges/restraints or opportunities with their current and expected impact on the overall industry sales. 

Our analyst implement several qualitative tools such as Ansoff’s Matrix, PESTEL analysis, Porter’s five force analysis among other to interpret and represent key industry findings. 

The second section of the study provides market size, estimates and forecast for key market segments and regional market. The final part of the report highlights key manufacturers/vendors operating in the associated market.   

1. Introduction

1.1. Market Definition

1.2. Market Scope 

2. Research Methodology

2.1. Primary Research

2.2. Secondary Sources

2.3. Assumptions & Exclusions 

3. Market Overview

3.1. Research Report Segmentation & Scope

3.2. Key Market Trend Analysis

3.2.1. Market Drivers

3.2.2. Market Restraint/Challenges

3.2.3. Market Opportunities

3.3. Porter’s Five Forces Analysis

3.4. Potential Venture Avenues

3.5. Market Share Analysis, 2016 

4. Type Overview

4.1. Introduction

4.2. Market Size & Forecast, 2015 to 2025

4.2.1. Air-Cavity QFNS

4.2.2. Plastic Molded QFNS

(Note: The segments mentioned above are tentative in nature and are subject to change as the research progresses) 

5. Application Overview

5.1. Introduction

5.2. Market Size & Forecast, 2015 to 2025

5.2.1. Portable Devices

5.2.2. Radio Frequency (RF)

5.2.3. Wearable Devices

5.2.4. Others

(Note: The segments mentioned above are tentative in nature and are subject to change as the research progresses) 

6. QFN Variants Overview

6.1. Introduction

6.2. Market Size & Forecast, 2015 to 2025

6.2.1. Very Thin Quad Flat No-Lead (VQFN)

6.2.2. Ultrathin Quad Flat No-Lead (UQFN)

6.2.3. Quad Flat No-Lead (QFN)

6.2.4. Others

(Note: The segments mentioned above are tentative in nature and are subject to change as the research progresses) 

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