Rochester, MN / Orlando, FL (May 14, 2014) LiquidCool Solutions, Inc. today announced that CEO Herb Zien will present at IEEE’s ITherm 2014 in Orlando, Florida. LiquidCool Solutions (LCS) is a technology development firm with patents surrounding cooling electronics by total immersion in a dielectric fluid. Zien will discuss the flaws with traditional air-cooling for datacenters and introduce the company’s patented liquid submersion technologies and its benefits for datacenter owners and managers.
Sponsored by the IEEE’s CPMT Society, ITherm 2014 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2014 will be held May 27 – 30 at the Walt Disney World Swan & Dolphin Hotel in Lake Buena Vista (Orlando), FL along with the 64th Electronic Components and Technology Conference (ECTC 2014), a premier electronics packaging conference.
Zien will present during ITherm’s “Cutting Edge Vendors” session, which will take place on Wednesday, May 28 between 7:00 and 9:00 PM local time. Zien’s topic, “Cooling Electronics with Air Was Never a Good Idea”, will cover the flaws in circulating air to cool datacenters.
“Air as an insulator, and pushing cold air up from the floor never made sense from an engineering perspective,” said Zien. LiquidCool Solutions offers a far more practical alternative by cooling electronics via total immersion in a dielectric fluid. Not only does it improve reliability, it saves capital, energy and floor space.”
Zien has written an accompanying white paper outlining his research and findings on the options for liquid cooling for electronics. The white paper, called Liquid Cooling for Datacenters, can be downloaded from the LiquidCool Solutions website: http://www.liquidcoolsolutions.com/documents/CoolingDatacenterswithLiquids.pdf
The Cutting Edge Vendor Session at ITherm 2014 will be chaired by DUSTIN W. DEMETRIOU, PhD, Advanced Thermal Energy Efficiency Lab, Systems & Technology Group, IBM. During ITherm 2014, LiquidCool Solutions will raffle an iPad Mini.
Additional information on ITherm 2014 can be found on the IEEE ITherm site: http://ieee-itherm.org
About LiquidCool Solutions
LiquidCool Solutions is a technology development firm with patents surrounding cooling electronics by total immersion in a dielectric fluid. LCS technology can be used to cool electronics of any shape and size. For rack-mounted servers the dielectric fluid is pumped from a central station through a manifold mounted on the rack into sealed IT devices, flooding each chassis and slowly flowing over and around the circuit boards and internal components via directed flow as shown in the illustration. Once the coolant exits the enclosure it is circulated outside the datacenter where the heat is captured for commercial reuse or rejected to the atmosphere by a commercially available fluid cooler.
LCS licenses its IP to OEMs looking for a cooling solution that saves energy, saves space, enhances reliability, operates silently, and can be surprisingly easy to maintain in the field. LCS cooling technology has the capacity of dissipating 100 kilowatts per rack at costs far less than alternative technologies.