Global Semiconductor Advanced Packaging Market by Key Players,Growth Drivers,Challenges,Share,Trends & Forecasts 2021

Semiconductor Advanced Packaging 2017
WiseGuyReports.Com Publish a New Market Research Report On -“Global Semiconductor Advanced Packaging Market by Key Players,Growth Drivers,Challenges,Share,Trends & Forecasts 2021”.

                            

The analysts forecast the global semiconductor advanced packaging market to grow at a CAGR of 8.45% during the period 2017-2021.

Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components. Semiconductor advanced packaging is a key component of the semiconductor manufacturing process. The package of a semiconductor device is usually made of materials such as plastic, metal, ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion. It also has contact pins or leads used to connect external circuits to the device; the package also dissipates the heat produced in the device. Some of the advanced packaging technologies used in semiconductor device packaging are fan-out wafer-level packaging (FO WLP), flip-chip, fan-in wafer-level packaging (FI WLP), and 2.5D/3D.

 

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Covered in this report 
The report covers the present scenario and the growth prospects of the global semiconductor advanced packaging market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-use segments.

The market is divided into the following segments based on geography: 
• Americas 
• APAC 
• EMEA

The report, Global Semiconductor Advanced Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors 
• Advanced Semiconductor Engineering (ASE) 
• Amkor Technology 
• Samsung Semiconductor (SAMSUNG) 
• TSMC (Taiwan Semiconductor Manufacturing Company) 

Other prominent vendors 
• China Wafer Level CSP 
• ChipMOS TECHNOLOGIES 
• FlipChip International 
• HANA Micron 
• Interconnect Systems (Molex) 
• Jiangsu Changjiang Electronics Technology (JCET) 
• King Yuan Electronics 
• Tongfu Microelectronics 
• Nepes 
• Powertech Technology (PTI) 
• SIGNETICS 
• Tianshui Huatian 
• Ultratech 
• UTAC 

Market driver 
• Complex semiconductor IC designs 
• For a full, detailed list, view our report

Market challenge 
• Rapid technological changes 
• For a full, detailed list, view our report

Market trend 
• Changes in wafer size 
• For a full, detailed list, view our report

Key questions answered in this report 
• What will the market size be in 2021 and what will the growth rate be? 
• What are the key market trends? 
• What is driving this market? 
• What are the challenges to market growth? 
• Who are the key vendors in this market space?

 

Report Details @  https://www.wiseguyreports.com/reports/1690658-global-semiconductor-advanced-packaging-market-2017-2021

 

Table Of Contents – Major Key Points

 

PART 01: Executive summary 

PART 02: Scope of the report 

PART 03: Research Methodology 

PART 04: Introduction 
• Market outline 
• Semiconductor value chain 

PART 05: Technology landscape 
• Back-end chip formation 
• Wafer-level vs die-level packaging 
• Roadmap of semiconductor packaging industry 
• Ecosystem of semiconductor IC packaging industry 

PART 06: Market landscape 
• Market overview 
• Market size and forecast 
• Five forces analysis 

PART 07: Segmentation by packaging technology 
• Global semiconductor advanced packaging market by technology 
• Flip-chip packaging 
• FI WLP 
• 2.5D/3D packaging 
• FO WLP 

PART 08: Segmentation by device type 
• Global semiconductor advanced packaging market by device type 
• Analog and mixed ICs 
• MEMS and sensors 
• Logic and memory devices 
• Wireless connectivity devices 
• CMOS image sensors 

PART 09: Geographical segmentation 
• Global semiconductor advanced packaging market by region 
• APAC 
• Americas 
• EMEA 

PART 10: Decision framework 

PART 11: Drivers and challenges 
• Market drivers 
• Market challenges 

PART 12: Market trends 
• Changes in wafer size 
• Integration of semiconductor components in vehicles 
• Increase in number of M&A 
• Short product lifecycle of mobile devices 
• Increase in number of OSAT vendors 
• High need for semiconductor memory devices 
• Growing acceptance of wearable devices 

Continue……

 

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