A flip chip is a typical semiconductor device that has been designed to incorporate solder bumps over the connection pads of the IC or micro-electromechanical system (MEMS). This methodology creates a very thorough and reliable connection between the component and the board.
In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
The major driving forces of the Flip Chip Technology Market have been the developments in the packaging of electronics like improving performance, maintaining high packaging density and increasing the reliability of circuits. However, the high cost associated with the implementation of the flip chip technology is impeding the growth of the market.
Flip chip technology can be applied to application processor, baseband, PMIC, memory devices, etc. products. For mobile communications, flip chip development is driven by increased device performance and package miniaturization trends, particularly for the CPU or so-called applications processor that powers smartphones and media tablets.
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The flip chip technology market in Asia Pacific region is expected to grow at the highest CAGR over the forecast period. With the rising technological innovation, competition and M&A activities in the industry, many local and regional vendors are offering specific application products to varied end-users, which make the Asia Pacific market a global leader in flip chip technology. The advantages of using flip chip technology in navy and consumer electronics industry have encouraged to adopt this flip chip technology in North America.
The worldwide Flip Chip Technology Market has been segmented into five distinct parts and they are listed as below:
- Packaging Technology: 3D, 2.5D and 2D packaging technology.
- Wafer Bumping Process: Tin-lead eutectic solder, copper(CU) pillar, gold stud plated solder and lead-free.
- Packaging Type: FC BGA, FC LGA, FC QFN, FC CSP, FC PGA and FC SIP.
- Applications: Automotive, telecommunications, consumer electronics, military & aerospace, industrial and medical devices.
- Products: LED, CMOS image sensor, mixed signal, CPU, analog, RF, SoC and power IC.
Some of the major players in Flip Chip Technology market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.
AUSTIN, Texas: The latest update for the industry is the news that flip chip technology is going to be launched in the commercial IC market. Earlier, this device was only utilized in high-end industries but now a company named LSI Corp’s has launched a series of four-layer laminate flip-chip packages that can be employed for networking and wireless-basestation markets.
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- Wafer manufacturers
- Raw material and manufacturing equipment suppliers
- Chip manufacturers
- System integrators
- Device manufacturers
- Foundry players
- Distributors and retailers
- Research organizations
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