Flip Chip Technology Market 2018: Global Overview, Historical Analysis, Business Strategy, Company Profile, Comprehensive Research Study, Growth Factors and Opportunity Assessment by Forecast 2023

Market Research Future
Market Research Future published a research report on “Flip Chip Technology Market Report- Forecast till 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Market Scenario:

A flip chip is a typical semiconductor device that has been designed to incorporate solder bumps over the connection pads of the IC or micro-electromechanical system (MEMS). This methodology creates a very thorough and reliable connection between the component and the board.

In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.

The major driving forces of the Flip Chip Technology Market have been the developments in the packaging of electronics like improving performance, maintaining high packaging density and increasing the reliability of circuits. However, the high cost associated with the implementation of the flip chip technology is impeding the growth of the market.

Flip chip technology can be applied to application processor, baseband, PMIC, memory devices, etc. products. For mobile communications, flip chip development is driven by increased device performance and package miniaturization trends, particularly for the CPU or so-called applications processor that powers smartphones and media tablets.

Get Sample of Report @ https://www.marketresearchfuture.com/sample_request/5381

Regional Analysis

The flip chip technology market in Asia Pacific region is expected to grow at the highest CAGR over the forecast period. With the rising technological innovation, competition and M&A activities in the industry, many local and regional vendors are offering specific application products to varied end-users, which make the Asia Pacific market a global leader in flip chip technology. The advantages of using flip chip technology in navy and consumer electronics industry have encouraged to adopt this flip chip technology in North America.

Segmental Analysis

The worldwide Flip Chip Technology Market has been segmented into five distinct parts and they are listed as below:

  • Packaging Technology: 3D, 2.5D and 2D packaging technology.
  • Wafer Bumping Process: Tin-lead eutectic solder, copper(CU) pillar, gold stud plated solder and lead-free.
  • Packaging Type: FC BGA, FC LGA, FC QFN, FC CSP, FC PGA and FC SIP.
  • Applications: Automotive, telecommunications, consumer electronics, military & aerospace, industrial and medical devices.
  • Products: LED, CMOS image sensor, mixed signal, CPU, analog, RF, SoC and power IC.

Key Players

Some of the major players in Flip Chip Technology market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.

Industry News

AUSTIN, Texas: The latest update for the industry is the news that flip chip technology is going to be launched in the commercial IC market. Earlier, this device was only utilized in high-end industries but now a company named LSI Corp’s has launched a series of four-layer laminate flip-chip packages that can be employed for networking and wireless-basestation markets.

Get complete Report @ https://www.marketresearchfuture.com/reports/flip-chip-technology-market-5381

Intended Audience

  • Wafer manufacturers
  • Raw material and manufacturing equipment suppliers
  • Chip manufacturers
  • System integrators
  • Device manufacturers
  • Foundry players
  • Distributors and retailers
  • Research organizations

About Us:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

Media Contact
Company Name: Market Research Future
Contact Person: Abhishek Sawant
Email: Send Email
Phone: +1 646 845 9312
Address:Market Research Future Office No. 528, Amanora Chambers Magarpatta Road, Hadapsar
City: Pune
State: Maharashtra
Country: India
Website: https://www.marketresearchfuture.com/reports/flip-chip-technology-market-5381