Flip Chip Technology Market – An Insight
The metallurgical industry is developing at a lightning speed, concepts like copper pillar and micro-bumping metallurgy are gaining a whole lot of traction. They are being put to work for developing consumer electronic products and smart devices like mobile phones and laptops. Owing to this the flip chip technology is also gaining its fair share of recognition. It can be utilized for normal-range as well as advanced-range applications. During the forecast period of 2017-2023, the global market for flip chip technology is expected to grow tremendously.
A flip chip is basically a conventional semiconductor that has been created so as to integrate solder bumps over the connection pads of the micro-electromechanical system (MEMS). This procedure can facilitate an extremely comprehensive and unswerving connection between the main source of electricity and the board.
The research report released by MRFR (Market Research Future) suggests that the market’s conversion rate will double up by the end of the forecast period i.e. 2023. The estimated CAGR for these years is 8.29%.
Recently, the field of electronics has witnessed a lot of advancement which serves as a major growth booster for the flip chip technology market. The developments like improved performance, efficient and reliable circuit boards and high packaging density further foster the growth of the market.
Get Sample of Report @ https://www.marketresearchfuture.com/sample_request/5381
Another major aspect that works in the favor of the market is flip-chips versatility. It forms an integral part of a number of devices like memory devices, application processors, PMIC, and baseband. This technology can also prove to be beneficial mobile communications, it can increase the performance bar and improve package miniaturization trends.
Although, the market may come across a small restraint in the form of expensiveness of the technology. However, efforts are being made in this direction and as the market progresses, it will cope with this small issue.
Key Players
Some of the major players in Flip Chip Technology market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.
Segmental Analysis
The worldwide Flip Chip Technology Market has been segmented into five distinct parts and they are listed as below:
- Packaging Technology: 3D, 2.5D and 2D packaging technology.
- Wafer Bumping Process: Tin-lead eutectic solder, copper(CU) pillar, gold stud plated solder and lead-free.
- Packaging Type: FC BGA, FC LGA, FC QFN, FC CSP, FC PGA and FC SIP.
- Applications: Automotive, telecommunications, consumer electronics, military & aerospace, industrial and medical devices.
- Products: LED, CMOS image sensor, mixed signal, CPU, analog, RF, SoC and power IC.
Regional Insights
The global market for flip chip technology has been successful in establishing itself across the globe. Some of the major regions include North America, Europe, Asia Pacific and Rest of the World.
Region-wise the area that has the upper hand is Asia Pacific. It is anticipated to stay in the lead and develop throughout the forecast period at an encouraging CAGR. The countries like China and India have a vast scope for development as they are the prime manufacturing centers. It is believed that these regions will open doors to many new and exciting opportunities for the market.
After Asia Pacific, North America is second in command, it grabs largest market share after APAC. This fact can be attributed to the presence of major market players in this area and the high expenditure on R&D activities.
Industry News
AUSTIN, Texas: The latest update for the industry is the news that flip chip technology is going to be launched in the commercial IC market. Earlier, this device was only utilized in high-end industries but now a company named LSI Corp’s has launched a series of four-layer laminate flip-chip packages that can be employed for networking and wireless-basestation markets.
Get complete Report @ https://www.marketresearchfuture.com/reports/flip-chip-technology-market-5381
Intended Audience
- Wafer manufacturers
- Raw material and manufacturing equipment suppliers
- Chip manufacturers
- System integrators
- Device manufacturers
- Foundry players
- Distributors and retailers
- Research organizations
About Us:
At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.
Media Contact
Company Name: Market Research Future
Contact Person: Akash Anand
Email: Send Email
Phone: +1 646 845 9312
Address:Market Research Future Office No. 528, Amanora Chambers Magarpatta Road, Hadapsar, Pune –
City: Pune
State: Maharashtra
Country: India
Website: https://www.marketresearchfuture.com/reports/flip-chip-technology-market-5381