3M Company, Alent PLC, BASF, H.B. Fuller, Henkel AG & Company, Indium Corporation, LG Chemical Limited, Mitsui Chemicals, Hitachi Chemicals, Dao Corning, Dow Chemicals and among others are some of the prominent players at the forefront of competition in the Global Electronic Adhesives Market and are profiled in MRFR Analysis.
Electronic Adhesives Market – Overview
Adhesives are critical components in design and manufacture of majority of electronic devices. As electronic devices are becoming smaller and more complex, there is a greater demand being made on components and material used in them. As the adhesives industry responds to the challenges of this market, new advances are widening the performance envelope for electronic adhesives. Change in polymer compositions, along with compounding differences are allowing properties to be tailored to meet specific application requirements which includes electrically conductive, flexibility for comfort, thermal-stability, sterilization, resistant snap among others.
Globally, the consumer and industrial applications require materials solutions that can meet the ever-changing demands for high reliability and improved performance. With decades of materials development expertise, majority of key player offers a wide range of assembly and protection materials for challenging industrial and consumer electronics environments. Prominent manufacturers offer advanced conformal coatings to be used in protecting electronics circuits from moisture, chemicals and other contaminants, which is expected to fuel the global electronic adhesive market in near future
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Industry/ Innovation/ Related News:
March 2016 – Electronics manufacturer The Morey Corporation (Morey) is working with Henkel Adhesive Technologies for more than 35 years. The launch of the innovative Loctite GC 10 solder paste helped further strengthening the partnership between these two companies. Morey supports leading electronic OEMs by delivering electronics design, manufacturing and life cycle solutions to bring innovations to dynamic and demanding markets. Therefore the company utilize a tailor-made package of fifteen solutions from Henkel’s comprehensive portfolio. This partnership agreement would fuel the demand of electronic adhesive market.
October 2017 – With Smartphone shipments worldwide projected to reach over 1.71 billion by 2020, Tesa UK is continuing to create and innovate the latest technology required to support electronic device manufacturers. Tesa has been a world leading exponent of adhesive tape development for 75 years and is currently at the forefront of developing and producing adhesive solutions for use in electronic devices. This innovation strategy would definitely fuel the electronic adhesive market.
December 2016 – DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, introduced an electronic adhesive that is easy-to-handle and ideal for use on high separating walls between sensors that have little space width and chip encapsulation. DELOMONOPOX GE7985 is designed for automotive and industrial applications where high reliability is required in combination with miniaturized designs. The product launch strategy of the company would propel the electronic adhesive market.
May 2016 – Techsil announced an agreement to supply M.G. Chemicals’ high performance range of adhesives, coatings sealants, cleaners and soldering supplies. Specifically designed for electronics production and design, the range includes some of this industry’s most popular products such as thermally and electrically conductive epoxy adhesives, thermal management compounds, conductive and conformal coatings, high temperature epoxies. The agreement would boost the annual growth of electronic adhesives in North America region.
Electronic Adhesives Market
Regionally, Asia Pacific region accounted largest market share in the global electronic adhesive market and expected to dominate during the forecast period due to economic trends in the region. In the Chinese domestic marketplace, consumer behavior, and developments to product technology and delivery systems have all merged to shape the electronic adhesives market. The electronic adhesive manufacturers in China is mostly comprises of small manufacturers and some of the prominent manufacturers. Over 185 suppliers are active in China’s hot melt and electronic adhesive industry, majority of which are privately owned Chinese companies. Out of these, 54% of total revenues are earned by 18 large-sized suppliers and remaining 46% is earned by 132 small-sized companies and 35 medium-sized companies. Some of the major supplier in the Chinese electronic adhesive market include Henkel, H.B. Fuller, Bostik, Tex Year Fine Chemical, Zhongshan CherngTay, and 3M China.
The report analyses the degree of competition among the industry players as well as industry growth and market scenario in China and the world. The global electronic adhesive market is at a growing stage, which represents moderate stats in terms of market value and overall volume. Over the past few years, electronic adhesive market has witnessed healthy demand in application such as conformal coatings, surface mount devices, potting and encapsulation and others. Globally, the market for electronic adhesive is highly fragmented and it is moving towards growth expansion by specifically adopting partnership, expansion and joint-venture strategies and product launch strategies.
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