Advanced Semiconductor Packaging Market 2019
Electronic devices are available in a variety of package types and include semiconductors (integrated circuits), magnets, capacitors, and resistors.
The semiconductor packaging services market has drawn the greatest attention in the investment community.
The Semiconductor packaging industry is expected to achieve a CAGR of 10% over the next three to five years. This trend is not only driven by the increasing market demand for packaging of components for various new semiconductor applications in the fields of radio, Internet and consumer products, but also external packaging assembly by semiconductor device manufacturers (SDM). Driven by the growth of test runs.
The global Advanced Semiconductor Packaging market is valued at 22200 million US$ in 2018 is expected to reach 49500 million US$ by the end of 2025, growing at a CAGR of 10.6% during 2019-2025.
This report focuses on Advanced Semiconductor Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Advanced Semiconductor Packaging market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.
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The following manufacturers are covered:
AMD
Intel Corp
Amkor Technology
STMicroelectronics
Hitachi Chemical
Infineon
Avery Dennison
Sumitomo Chemical
ASE Group
Kyocera
Segment by Regions
North America
Europe
China
Japan
Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other End Users
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Table of Contents –Analysis of Key Points
1 Advanced Semiconductor Packaging Market Overview
1.1 Product Overview and Scope of Advanced Semiconductor Packaging
1.2 Advanced Semiconductor Packaging Segment by Type
1.2.1 Global Advanced Semiconductor Packaging Production Growth Rate Comparison by Type (2014-2025)
1.2.2 Fan-Out Wafer-Level Packaging (FO WLP)
1.2.3 Fan-In Wafer-Level Packaging (FI WLP)
1.2.4 Flip Chip (FC)
1.2.5 2.5D/3D
1.3 Advanced Semiconductor Packaging Segment by Application
1.3.1 Advanced Semiconductor Packaging Consumption Comparison by Application (2014-2025)
1.3.2 Telecommunications
1.3.3 Automotive
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Consumer Electronics
1.3.7 Other End Users
1.4 Global Advanced Semiconductor Packaging Market by Region
1.4.1 Global Advanced Semiconductor Packaging Market Size Region
1.4.2 North America Status and Prospect (2014-2025)
1.4.3 Europe Status and Prospect (2014-2025)
1.4.4 China Status and Prospect (2014-2025)
1.4.5 Japan Status and Prospect (2014-2025)
1.5 Global Advanced Semiconductor Packaging Market Size
1.5.1 Global Advanced Semiconductor Packaging Revenue (2014-2025)
1.5.2 Global Advanced Semiconductor Packaging Production (2014-2025)
………..
7 Company Profiles and Key Figures in Advanced Semiconductor Packaging Business
7.1 AMD
7.1.1 AMD Advanced Semiconductor Packaging Production Sites and Area Served
7.1.2 Advanced Semiconductor Packaging Product Introduction, Application and Specification
7.1.3 AMD Advanced Semiconductor Packaging Production, Revenue, Price and Gross Margin (2014-2019)
7.1.4 Main Business and Markets Served
7.2 Intel Corp
7.2.1 Intel Corp Advanced Semiconductor Packaging Production Sites and Area Served
7.2.2 Advanced Semiconductor Packaging Product Introduction, Application and Specification
7.2.3 Intel Corp Advanced Semiconductor Packaging Production, Revenue, Price and Gross Margin (2014-2019)
7.2.4 Main Business and Markets Served
7.3 Amkor Technology
7.3.1 Amkor Technology Advanced Semiconductor Packaging Production Sites and Area Served
7.3.2 Advanced Semiconductor Packaging Product Introduction, Application and Specification
7.3.3 Amkor Technology Advanced Semiconductor Packaging Production, Revenue, Price and Gross Margin (2014-2019)
7.3.4 Main Business and Markets Served
7.4 STMicroelectronics
7.4.1 STMicroelectronics Advanced Semiconductor Packaging Production Sites and Area Served
7.4.2 Advanced Semiconductor Packaging Product Introduction, Application and Specification
7.4.3 STMicroelectronics Advanced Semiconductor Packaging Production, Revenue, Price and Gross Margin (2014-2019)
7.4.4 Main Business and Markets Served
7.5 Hitachi Chemical
7.5.1 Hitachi Chemical Advanced Semiconductor Packaging Production Sites and Area Served
7.5.2 Advanced Semiconductor Packaging Product Introduction, Application and Specification
7.5.3 Hitachi Chemical Advanced Semiconductor Packaging Production, Revenue, Price and Gross Margin (2014-2019)
7.5.4 Main Business and Markets Served
7.6 Infineon
7.6.1 Infineon Advanced Semiconductor Packaging Production Sites and Area Served
7.6.2 Advanced Semiconductor Packaging Product Introduction, Application and Specification
7.6.3 Infineon Advanced Semiconductor Packaging Production, Revenue, Price and Gross Margin (2014-2019)
7.6.4 Main Business and Markets Served
7.7 Avery Dennison
7.7.1 Avery Dennison Advanced Semiconductor Packaging Production Sites and Area Served
7.7.2 Advanced Semiconductor Packaging Product Introduction, Application and Specification
7.7.3 Avery Dennison Advanced Semiconductor Packaging Production, Revenue, Price and Gross Margin (2014-2019)
7.7.4 Main Business and Markets Served
7.8 Sumitomo Chemical
7.8.1 Sumitomo Chemical Advanced Semiconductor Packaging Production Sites and Area Served
7.8.2 Advanced Semiconductor Packaging Product Introduction, Application and Specification
7.8.3 Sumitomo Chemical Advanced Semiconductor Packaging Production, Revenue, Price and Gross Margin (2014-2019)
7.8.4 Main Business and Markets Served
Continued…..
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