Active and Intelligent Packaging Market Global Analysis and 2023 Forecasts – North America is Expected to Account for a Significant Share in the Market

Market expected to reach a value of USD 28.00 billion by 2023
OrbisResearch.com has published “Global Active and Intelligent Packaging Market-Analysis of Growth, Trends and Forecasts (2018-2023)” reports to its database. Key players listed in the report are BASF SE, AMCOR LIMITED, HONEYWELL INTERNATIONAL INC., LANDEC CORPORATION, BEMIS COMPANY INC., CROWN HOLDINGS INC., BALL CORPORATION (REXAM PLC), SONOCO LP, and GRAPHIC PACKAGING, amongst others.

The active and intelligent packaging market was valued at USD 17.48 billion in 2017, and it is expected to reach a value of USD 28.00 billion by 2023, at a CAGR of 8.17% during the forecast period (2018 – 2023). The regions considered in the scope of the report include North America, Europe, Asia-Pacific, Latin America and the Middle East & Africa.

According to the Center for Disease Control and Prevention (CDC), there are about 48 million cases of foodborne illness, annually, in the United States; which is the equivalent of sickening 1 in 6 Americans each year. In addition, each year, these illnesses result in an estimated 128,000 hospitalizations and 3,000 deaths. Thus, increasing awareness about food-borne diseases and increasing demand for fresh and quality packaged food, consumer convenience and manufacturers concern for longer shelf-life of the food products is driving the market for global active and smart packaging technology for food and beverage market. Owing to the ever-growing urban population and changing lifestyle trends, the demand for ready-to-eat, frozen, and packaged food is increasing extensively across the globe. The supply of frozen foods, meat products, vegetables, and fruits is surpassing boundaries, thus giving regional markets a global exposure. Moreover, with the retail industry propelling at a rapid pace, the need for attractive and advanced packaging is also increasing. Further, increase in counterfeit products in developing countries has also compelled companies to use technologies like RFID during packaging. All these factors account for a significant rise in the demand for active and intelligent packaging. However, factors such as higher costs of installation and implementation and security issues concerned with these systems are hindering the growth of the market.

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Longer Shelf-Life and Changing Lifestyle of People Are Driving Market Growth
The immense pressure on manufacturers to reduce the use of preservatives in food products has increased the prominence of packaging. With supply chains becoming increasingly global, longer shelf-lives are very important for products to be able reach the customers in their intended state. Increasing globalization has created the demand for products to be transported all across the world without any loss in their nutritional value or alteration of their chemical composition. As companies are looking to expand into emerging markets, with no sophisticated cold storage chains, producing packages that provide longer shelf-life have become imperative. Active and intelligent packaging has superior barrier capabilities and can effectively protect the product from moisture and oxygen. Shelf Life Sensing, Temperature Indicators, RFID, and other technological systems are generally used systems in active and intelligent packaging systems and even nano packaging technologies are inducing the modified atmosphere packaging systems to increase sustainability. Healthcare, food and beverage industries are inclined toward using antimicrobial packaging systems to increase durability and future consumption. Thus, the need to provide longer shelf-life is one of the major drivers for the active and intelligent packaging market.

Frozen Food Expected to Witness a Rise in the Demand for Safe Motors
Frozen food has established itself as an alternative to prepared meals through the combination of product and packaging innovation. The demand for this segment has witnessed strong growth due to growing demand for fast-to-prepare food and new product launches. Growing demand from emerging economies is another driving factor for this segment’s growth. These products have strict packaging regulations. Safety and longer shelf-life are the primary packaging requirements for these goods. Thus, active and intelligent packaging is increasingly being employed for packaging of frozen foods. With consumers now being highly health conscious and aware of health hazards related to edible products, the demand for active packed goods is growing. Increasing growth of frozen foods consumption and growing demand for these products in Asia-Pacific is expected to drive the growth of this market during the forecast period.

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Key Developments in the Market
November 2017 – Stora Enso had joined forces with Microsoft to bring cloud-based intelligent packaging solutions to clients, globally. The global and scalable cloud platform enables reliable and secure data collection and analytics for clients investing in innovative intelligent packaging solutions. Intelligent Packaging by Stora Enso integrates widely adopted RFID technology, which enabled the product to be tracked, traced and tamper proofed throughout the entire supply chain.
May 2017 – Bemis Company Inc. was honored by DuPont for the Kellogg’s Nutri-Grain Bakery Delights package featuring textured film. This package received a Silver Award in the 2017 DuPont Awards for Packaging Innovation. To capture the attention of millennial shoppers, the package was designed to look, feel, crinkle and crunch like paper.
March 2017 – BASF New Business exhibited at LOPEC trade show in Munich, which is one of the most important exhibitions and conferences for the Printed Electronics Industry in Europe attracting several thousands of visitors from all over the globe. BASF presented its new InkSet 1000SP package for fully structured transistors. It is a comprehensive package, which included inks for planarization, contact treatment, semiconductor, gate dielectric and interlayer dielectric, as well as a complete process description for their application.

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